Datasheets
DIP-308-001BLF by: Amphenol FCi

IC Socket, DIP8, 8 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder, LEAD FREE

Part Details for DIP-308-001BLF by Amphenol FCi

Overview of DIP-308-001BLF by Amphenol FCi

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Electronic Manufacturing Entertainment and Gaming

Available Datasheets

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C8231A Rochester Electronics LLC Math Coprocessor, 8-Bit, NMOS, CDIP24, DIP-24
P8085AH-1 Rochester Electronics LLC Microprocessor, 8-Bit, 6MHz, NMOS, PDIP40, PLASTIC, DIP-40
TCM3105NL Rochester Electronics LLC Modem, PDIP16, 0.300 INCH, PLASTIC, DIP-16

Part Details for DIP-308-001BLF

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DIP-308-001BLF Part Data Attributes

DIP-308-001BLF Amphenol FCi
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DIP-308-001BLF Amphenol FCi IC Socket, DIP8, 8 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder, LEAD FREE
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer FCI
Package Description LEAD FREE
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8536.69.40.40
Body Breadth 0.4 inch
Body Depth 0.165 inch
Body Length 0.3 inch
Contact Finish Mating GOLD (30) OVER NICKEL
Contact Finish Termination GOLD OVER NICKEL
Contact Material NOT SPECIFIED
Contact Style RND PIN-SKT
Device Socket Type IC SOCKET
Device Type Used On DIP8
Housing Material GLASS FILLED POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER
JESD-609 Code e4
Mating Contact Pitch 0.1 inch
Mounting Style STRAIGHT
Number of Contacts 8
PCB Contact Pattern RECTANGULAR
PCB Contact Row Spacing 0.30000000000000004 mm
Terminal Pitch 2.54 mm
Termination Type SOLDER

Alternate Parts for DIP-308-001BLF

This table gives cross-reference parts and alternative options found for DIP-308-001BLF. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DIP-308-001BLF, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
DIP-308-001B-R IC Socket, Amphenol FCi DIP-308-001BLF vs DIP-308-001B-R
Part Number Description Manufacturer Compare
210-83-308-41-001000 IC Socket, Mill-Max Mfg Corp DIP-308-001BLF vs 210-83-308-41-001000
HDS308-01TG IC Socket, DIP8, 8 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder, Advanced Interconnections Corp DIP-308-001BLF vs HDS308-01TG
LS308-01GG IC Socket, DIP8, 8 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder, Advanced Interconnections Corp DIP-308-001BLF vs LS308-01GG
DIP-308-001B-R IC Socket, Amphenol FCi DIP-308-001BLF vs DIP-308-001B-R
1-6437539-0 DIP SOCKET,8 CONTACTS,0.1 TERM PITCH,0.295 ROW SPACING,PC TAIL TERMINAL TE Connectivity DIP-308-001BLF vs 1-6437539-0
ICE-083-E2-TT DIP8, IC SOCKET 3M Electronics DIP-308-001BLF vs ICE-083-E2-TT
ICE-083-CP-TT DIP8, IC SOCKET 3M Electronics DIP-308-001BLF vs ICE-083-CP-TT
ICE-083-E350-TG DIP8, IC SOCKET 3M Electronics DIP-308-001BLF vs ICE-083-E350-TG
ICE-083-E1-TG30 DIP8, IC SOCKET 3M Electronics DIP-308-001BLF vs ICE-083-E1-TG30
508-AG11D-ESL-LF IC Socket, 8 Contact(s), 2.54mm Term Pitch, 7.62mm Row Spacing, Solder TE Connectivity DIP-308-001BLF vs 508-AG11D-ESL-LF

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