Part Details for CY27C256T-70WI by Cypress Semiconductor
Overview of CY27C256T-70WI by Cypress Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (6 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Part Details for CY27C256T-70WI
CY27C256T-70WI CAD Models
CY27C256T-70WI Part Data Attributes
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CY27C256T-70WI
Cypress Semiconductor
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Datasheet
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CY27C256T-70WI
Cypress Semiconductor
UVPROM, 32KX8, 70ns, CMOS, CDIP28, 0.300 INCH, WINDOWED, CERDIP-28
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
| Part Package Code | DIP | |
| Package Description | DIP, | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 70 ns | |
| JESD-30 Code | R-GDIP-T28 | |
| JESD-609 Code | e0 | |
| Memory Density | 262144 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 32KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Position | DUAL |
Alternate Parts for CY27C256T-70WI
This table gives cross-reference parts and alternative options found for CY27C256T-70WI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY27C256T-70WI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 5962-8606318UX | UVPROM, 32KX8, 70ns, CMOS, CDIP28, CERAMIC, DIP-28 | Teledyne e2v | CY27C256T-70WI vs 5962-8606318UX |
| CY27C256-70WMB | UVPROM, 32KX8, 70ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Cypress Semiconductor | CY27C256T-70WI vs CY27C256-70WMB |
| CY27C256A-70WI | UVPROM, 32KX8, 70ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-28 | Cypress Semiconductor | CY27C256T-70WI vs CY27C256A-70WI |
| 5962-8606318XA | UVPROM, 32KX8, 70ns, CMOS, CDIP28, CERAMIC, DIP-28 | Micross Components | CY27C256T-70WI vs 5962-8606318XA |
| 5962-8606308UX | UVPROM, 32KX8, 70ns, CMOS, CDIP28, CERAMIC, DIP-28 | QP Semiconductor | CY27C256T-70WI vs 5962-8606308UX |
| WS57C256F-70T | UVPROM, 32KX8, 70ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28 | Teledyne e2v | CY27C256T-70WI vs WS57C256F-70T |
| 5962-8606318UA | UVPROM, 32KX8, 70ns, CMOS, CDIP28, CERAMIC, DIP-28 | QP Semiconductor | CY27C256T-70WI vs 5962-8606318UA |
| 5962-8606318XX | UVPROM, 32KX8, 70ns, CMOS, CDIP28, CERAMIC, DIP-28 | QP Semiconductor | CY27C256T-70WI vs 5962-8606318XX |
| 5962-8606318XA | UVPROM, 32KX8, 70ns, CMOS, CDIP28, CERAMIC, DIP-28 | Teledyne e2v | CY27C256T-70WI vs 5962-8606318XA |
| 5962-8606318UX | UVPROM, 32KX8, 70ns, CMOS, CDIP28, CERAMIC, DIP-28 | QP Semiconductor | CY27C256T-70WI vs 5962-8606318UX |