Part Details for CY27C256-70WMB by Cypress Semiconductor
Overview of CY27C256-70WMB by Cypress Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Part Details for CY27C256-70WMB
CY27C256-70WMB CAD Models
CY27C256-70WMB Part Data Attributes
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CY27C256-70WMB
Cypress Semiconductor
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Datasheet
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CY27C256-70WMB
Cypress Semiconductor
UVPROM, 32KX8, 70ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
| Part Package Code | DIP | |
| Package Description | 0.600 INCH, WINDOWED, CERDIP-28 | |
| Pin Count | 28 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 70 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-GDIP-T28 | |
| JESD-609 Code | e0 | |
| Memory Density | 262144 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 32KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP28,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 12.5 V | |
| Qualification Status | Not Qualified | |
| Screening Level | 38535Q/M;38534H;883B | |
| Standby Current-Max | 0.02 A | |
| Supply Current-Max | 0.055 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL |
Alternate Parts for CY27C256-70WMB
This table gives cross-reference parts and alternative options found for CY27C256-70WMB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY27C256-70WMB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 5962-8606318XX | UVPROM, 32KX8, 70ns, CMOS, CDIP28, CERAMIC, DIP-28 | QP Semiconductor | CY27C256-70WMB vs 5962-8606318XX |
| CY27C256T-70WI | UVPROM, 32KX8, 70ns, CMOS, CDIP28, 0.300 INCH, WINDOWED, CERDIP-28 | Cypress Semiconductor | CY27C256-70WMB vs CY27C256T-70WI |
| WS57C256F-70T | UVPROM, 32KX8, 70ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28 | Teledyne e2v | CY27C256-70WMB vs WS57C256F-70T |
| AS27C256A-70JM | Memory IC | Micross Components | CY27C256-70WMB vs AS27C256A-70JM |
| WS57C256F-70DMB | UVPROM, 32KX8, 70ns, CMOS, CDIP28, 0.600 INCH, CERDIP-28 | Waferscale Integration Inc | CY27C256-70WMB vs WS57C256F-70DMB |
| 5662-8606318QYA | UVPROM, 32KX8, 70ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | Teledyne e2v | CY27C256-70WMB vs 5662-8606318QYA |
| 5962-8606318UX | UVPROM, 32KX8, 70ns, CMOS, CDIP28, CERAMIC, DIP-28 | QP Semiconductor | CY27C256-70WMB vs 5962-8606318UX |
| QP27C256-70/QYA | UVPROM, 32KX8, 70ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | Teledyne e2v | CY27C256-70WMB vs QP27C256-70/QYA |
| IS27HC256-70CWI | UVPROM, 32KX8, 70ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28 | Integrated Silicon Solution Inc | CY27C256-70WMB vs IS27HC256-70CWI |
| QP27C256-70/XA | UVPROM, 32KX8, 70ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | Teledyne e2v | CY27C256-70WMB vs QP27C256-70/XA |