Part Details for AMD-K6-2/266BNZ by AMD
Overview of AMD-K6-2/266BNZ by AMD
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Industrial Automation
Computing and Data Storage
Renewable Energy
Robotics and Drones
Part Details for AMD-K6-2/266BNZ
AMD-K6-2/266BNZ CAD Models
AMD-K6-2/266BNZ Part Data Attributes:
|
AMD-K6-2/266BNZ
AMD
Buy Now
Datasheet
|
Compare Parts:
AMD-K6-2/266BNZ
AMD
RISC Microprocessor, 32-Bit, 266MHz, CMOS, PBGA360, CERAMIC, BGA-360
|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Part Package Code | BGA | |
Package Description | BGA, BGA360,19X19,50 | |
Pin Count | 360 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Additional Feature | ALSO REQUIRES 3.135V TO 3.6V FOR I/O | |
Address Bus Width | 32 | |
Bit Size | 32 | |
Boundary Scan | YES | |
Clock Frequency-Max | 66 MHz | |
External Data Bus Width | 64 | |
Format | FLOATING POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-PBGA-B360 | |
JESD-609 Code | e0 | |
Length | 25 mm | |
Low Power Mode | YES | |
Number of Terminals | 360 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA360,19X19,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.92 mm | |
Speed | 266 MHz | |
Supply Voltage-Max | 1.9 V | |
Supply Voltage-Min | 1.7 V | |
Supply Voltage-Nom | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 25 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for AMD-K6-2/266BNZ
This table gives cross-reference parts and alternative options found for AMD-K6-2/266BNZ. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AMD-K6-2/266BNZ, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
PC7447MGHU1000NC | RISC Microprocessor, 32-Bit, 1000MHz, CMOS, CBGA360, HITCE, CERAMIC, BGA-360 | Atmel Corporation | AMD-K6-2/266BNZ vs PC7447MGHU1000NC |
TSXPC750AMG10LE | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Atmel Corporation | AMD-K6-2/266BNZ vs TSXPC750AMG10LE |
PPC7448VS867NC | 32-BIT, 867MHz, RISC PROCESSOR, CLGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HCTE, CERAMIC, LGA-360 | Freescale Semiconductor | AMD-K6-2/266BNZ vs PPC7448VS867NC |
PC7448MLH1250ND | RISC Microprocessor, 32-Bit, 1250MHz, CMOS, CBGA360, 25 X 25 MM, 1.80 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCE, LGA-360 | e2v technologies | AMD-K6-2/266BNZ vs PC7448MLH1250ND |
IBM25PPC750-DB0M2660 | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 | IBM | AMD-K6-2/266BNZ vs IBM25PPC750-DB0M2660 |
PC7448MGH600KD | RISC Microprocessor, 32-Bit, 600MHz, CMOS, CBGA360, 25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCE, BGA-360 | e2v technologies | AMD-K6-2/266BNZ vs PC7448MGH600KD |
TSPC750AVGSB/Q12LE | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CGA-360 | Thales Group | AMD-K6-2/266BNZ vs TSPC750AVGSB/Q12LE |
MC7447AVU1267LB | 32-BIT, 1267MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, BGA-360 | Freescale Semiconductor | AMD-K6-2/266BNZ vs MC7447AVU1267LB |
TSXC750AMGU/T8LH | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Thales Group | AMD-K6-2/266BNZ vs TSXC750AMGU/T8LH |
MPC8541ECPXAPEX | 32-BIT, 1600MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HCTE, CERAMIC, BGA-360 | Freescale Semiconductor | AMD-K6-2/266BNZ vs MPC8541ECPXAPEX |