Part Details for AM29F040-150/BXA by AMD
Overview of AM29F040-150/BXA by AMD
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Industrial Automation
Computing and Data Storage
Renewable Energy
Robotics and Drones
Part Details for AM29F040-150/BXA
AM29F040-150/BXA CAD Models
AM29F040-150/BXA Part Data Attributes:
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AM29F040-150/BXA
AMD
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Datasheet
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AM29F040-150/BXA
AMD
Flash, 512KX8, 150ns, CDIP32, HERMETIC SEALED, CERAMIC, DIP-32
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Part Package Code | DIP | |
| Package Description | HERMETIC SEALED, CERAMIC, DIP-32 | |
| Pin Count | 32 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 150 ns | |
| Additional Feature | BULK ERASE; EMBEDDED ALGORITHM | |
| JESD-30 Code | R-GDIP-T32 | |
| Length | 42.1005 mm | |
| Memory Density | 4194304 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 512KX8 | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 5 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.588 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Type | NOR TYPE | |
| Width | 15.24 mm |
Alternate Parts for AM29F040-150/BXA
This table gives cross-reference parts and alternative options found for AM29F040-150/BXA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM29F040-150/BXA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AM29F040-150PEB | Flash, 512KX8, 150ns, PDIP32, PLASTIC, DIP-32 | Spansion | AM29F040-150/BXA vs AM29F040-150PEB |
| W29C040-15B | Flash, 512KX8, 150ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Winbond Electronics Corp | AM29F040-150/BXA vs W29C040-15B |
| HY29F040AP-15I | Flash, 512KX8, 150ns, PDIP32, PLASTIC, DIP-32 | SK Hynix Inc | AM29F040-150/BXA vs HY29F040AP-15I |
| HY29F040P-150E | Flash, 512KX8, 150ns, PDIP32, PLASTIC, DIP-32 | SK Hynix Inc | AM29F040-150/BXA vs HY29F040P-150E |
| AM29F040-150PI | Flash, 512KX8, 150ns, PDIP32, PLASTIC, DIP-32 | Spansion | AM29F040-150/BXA vs AM29F040-150PI |
| AM29F040-150PC | Flash, 512KX8, 150ns, PDIP32, PLASTIC, DIP-32 | AMD | AM29F040-150/BXA vs AM29F040-150PC |
| AM29F040-150PI | Flash, 512KX8, 150ns, PDIP32, PLASTIC, DIP-32 | AMD | AM29F040-150/BXA vs AM29F040-150PI |
| HY29F040AP-15E | Flash, 512KX8, 150ns, PDIP32, PLASTIC, DIP-32 | SK Hynix Inc | AM29F040-150/BXA vs HY29F040AP-15E |
| HY29F040P-150C | Flash, 512KX8, 150ns, PDIP32, PLASTIC, DIP-32 | SK Hynix Inc | AM29F040-150/BXA vs HY29F040P-150C |
| AM29F040-150PC | Flash, 512KX8, 150ns, PDIP32, PLASTIC, DIP-32 | Spansion | AM29F040-150/BXA vs AM29F040-150PC |