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Flash, 128KX8, 70ns, PDIP32, LEAD FREE, PLASTIC, MO-015GAP, DIP-32
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
HM2P70PKT165GLLF | Amphenol Communications Solutions | Back Plane Connectors,2mm Hard Metric Series,Millipacs, Vertical Header, Type B22, 110 Signal Pin, Press Fit Tail, 500 mating cycles-Rear Plug up and ROHS Compliant | |
HM2P70PKE124GLLF | Amphenol Communications Solutions | Back Plane Connectors,2mm Hard Metric Series,Millipacs, Vertical Header, Type B22, 110 Signal Pin, Press Fit Tail, 500 mating cycles-Rear Plug up and ROHS Compliant | |
HM2P70PKE127GFLF | Amphenol Communications Solutions | Back Plane Connectors,2mm Hard Metric Series,Millipacs, Vertical Header, Type B22, 110 Signal Pin, Press Fit Tail, 250 mating cycles-Rear Plug up and ROHS Compliant |
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AM29F010B-70PK
Spansion
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Datasheet
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Compare Parts:
AM29F010B-70PK
Spansion
Flash, 128KX8, 70ns, PDIP32, LEAD FREE, PLASTIC, MO-015GAP, DIP-32
|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | SPANSION INC | |
Part Package Code | DIP | |
Package Description | LEAD FREE, PLASTIC, MO-015GAP, DIP-32 | |
Pin Count | 32 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A001.A.2.C | |
HTS Code | 8542.32.00.51 | |
Samacsys Manufacturer | Spansion | |
Access Time-Max | 70 ns | |
Command User Interface | YES | |
Data Polling | YES | |
Endurance | 1000000 Write/Erase Cycles | |
JESD-30 Code | R-PDIP-T32 | |
JESD-609 Code | e3 | |
Length | 42.037 mm | |
Memory Density | 1048576 bit | |
Memory IC Type | FLASH | |
Memory Width | 8 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Sectors/Size | 8 | |
Number of Terminals | 32 | |
Number of Words | 131072 words | |
Number of Words Code | 128000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Organization | 128KX8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | DIP | |
Package Equivalence Code | DIP32,.6 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Programming Voltage | 5 V | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.715 mm | |
Sector Size | 16K | |
Standby Current-Max | 0.000005 A | |
Supply Current-Max | 0.04 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Finish | MATTE TIN | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Toggle Bit | YES | |
Type | NOR TYPE | |
Width | 15.24 mm |
This table gives cross-reference parts and alternative options found for AM29F010B-70PK. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM29F010B-70PK, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
W29C010-70 | Flash, 128KX8, 70ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Winbond Electronics Corp | AM29F010B-70PK vs W29C010-70 |
M29F010B90P3 | 128KX8 FLASH 5V PROM, 70ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | STMicroelectronics | AM29F010B-70PK vs M29F010B90P3 |
M29F010B90P6 | 128KX8 FLASH 5V PROM, 70ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | STMicroelectronics | AM29F010B-70PK vs M29F010B90P6 |
M29F010B70P1T | 128KX8 FLASH 5V PROM, 70ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | STMicroelectronics | AM29F010B-70PK vs M29F010B70P1T |
WMF128K8-70CI5A | Flash, 128KX8, 70ns, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | AM29F010B-70PK vs WMF128K8-70CI5A |
M29F010B90P1 | 128KX8 FLASH 5V PROM, 70ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | STMicroelectronics | AM29F010B-70PK vs M29F010B90P1 |
AT49HF010-70PL | Flash, 128KX8, 70ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Atmel Corporation | AM29F010B-70PK vs AT49HF010-70PL |
M29F010B120P6 | 128KX8 FLASH 5V PROM, 70ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | STMicroelectronics | AM29F010B-70PK vs M29F010B120P6 |
SST29SF010-70-4C-PH | Flash, 128KX8, 70ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Silicon Storage Technology | AM29F010B-70PK vs SST29SF010-70-4C-PH |
WMF128K8X-70CI5 | Flash, 128KX8, 70ns, CDIP32, 0.600 INCH, SINGLE CAVITY, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | AM29F010B-70PK vs WMF128K8X-70CI5 |