There are no models available for this part yet.
Overview of AM28F010-70EEB by Rochester Electronics LLC
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for AM28F010-70EEB by Rochester Electronics LLC
Part Data Attributes for AM28F010-70EEB by Rochester Electronics LLC
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|---|---|
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Part Life Cycle Code
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Contact Manufacturer
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|
Ihs Manufacturer
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ROCHESTER ELECTRONICS LLC
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Package Description
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TSSOP,
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Reach Compliance Code
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unknown
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ECCN Code
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3A001.A.2.C
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HTS Code
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8542.32.00.51
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Access Time-Max
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70 ns
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JESD-30 Code
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R-PDSO-G32
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JESD-609 Code
|
e0
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Length
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18.4 mm
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Memory Density
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1048576 bit
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Memory IC Type
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FLASH
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Memory Width
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8
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Number of Functions
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1
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Number of Terminals
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32
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Number of Words
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131072 words
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Number of Words Code
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128000
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Operating Mode
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ASYNCHRONOUS
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Operating Temperature-Max
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125 °C
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Operating Temperature-Min
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-55 °C
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Organization
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128KX8
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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TSSOP
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Package Shape
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RECTANGULAR
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Package Style
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SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
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Parallel/Serial
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PARALLEL
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Programming Voltage
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12 V
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Seated Height-Max
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1.2 mm
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Supply Voltage-Max (Vsup)
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5.5 V
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Supply Voltage-Min (Vsup)
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4.5 V
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Supply Voltage-Nom (Vsup)
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5 V
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Surface Mount
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YES
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Technology
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CMOS
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Temperature Grade
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MILITARY
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Terminal Finish
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TIN LEAD
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Terminal Form
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GULL WING
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Terminal Pitch
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0.5 mm
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Terminal Position
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DUAL
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Type
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NOR TYPE
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Width
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8 mm
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Alternate Parts for AM28F010-70EEB
This table gives cross-reference parts and alternative options found for AM28F010-70EEB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM28F010-70EEB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AT27LV256R-30JI | Memory IC | Microchip Technology Inc | AM28F010-70EEB vs AT27LV256R-30JI |
| AS29LL008-200TC | Flash, 1MX8, 200ns, PDSO40, 10 X 20 MM, TSOP1-40 | Alliance Semiconductor Corporation | AM28F010-70EEB vs AS29LL008-200TC |
| 5962-9669201HUC | Flash Module, 512KX8, 150ns, CDMA32, UNFORMED, FP-32 | Cobham Power Products | AM28F010-70EEB vs 5962-9669201HUC |
| HY234100G-200 | MASK ROM, 512KX8, 200ns, CMOS, PDSO40, 0.525 INCH, PLASTIC, SOP-40 | SK Hynix Inc | AM28F010-70EEB vs HY234100G-200 |
| AM28F010-150C3PC | Flash, 128KX8, 150ns, PDIP32, PLASTIC, DIP-32 | Rochester Electronics LLC | AM28F010-70EEB vs AM28F010-150C3PC |
| M27V401-250L1 | 512KX8 UVPROM, 250ns, CQCC32, 2.80 MM HEIGHT, WINDOWED, CERAMIC, LCC-32 | STMicroelectronics | AM28F010-70EEB vs M27V401-250L1 |
| M27V512-200B1 | 64KX8 OTPROM, 200ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | STMicroelectronics | AM28F010-70EEB vs M27V512-200B1 |
| M27V101-250L6 | 128KX8 UVPROM, 250ns, CQCC32, 2.80 MM HEIGHT, WINDOWED, CERAMIC, LCC-32 | STMicroelectronics | AM28F010-70EEB vs M27V101-250L6 |
| M87C257-20XC1 | 32KX8 OTPROM, 150ns, PQCC32, LEAD FREE, PLASTIC, LCC-32 | STMicroelectronics | AM28F010-70EEB vs M87C257-20XC1 |
| AT27C512-25JC | Memory IC | Microchip Technology Inc | AM28F010-70EEB vs AT27C512-25JC |