Part Details for AM27S33PCB by AMD
Overview of AM27S33PCB by AMD
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Part Details for AM27S33PCB
AM27S33PCB CAD Models
AM27S33PCB Part Data Attributes
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AM27S33PCB
AMD
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Datasheet
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AM27S33PCB
AMD
OTP ROM, 1KX4, 55ns, Bipolar, PDIP18, PLASTIC, DIP-18
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Part Package Code | DIP | |
Package Description | DIP, DIP18,.3 | |
Pin Count | 18 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Access Time-Max | 25 ns | |
JESD-30 Code | R-PDIP-T18 | |
JESD-609 Code | e0 | |
Length | 22.987 mm | |
Memory Density | 4096 bit | |
Memory IC Type | OTP ROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 18 | |
Number of Words | 1024 words | |
Number of Words Code | 512 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 75 °C | |
Operating Temperature-Min | ||
Organization | 512X8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | DIP | |
Package Equivalence Code | DIP18,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.08 mm | |
Supply Current-Max | 0.14 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | BIPOLAR | |
Temperature Grade | COMMERCIAL EXTENDED | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 7.62 mm |
Alternate Parts for AM27S33PCB
This table gives cross-reference parts and alternative options found for AM27S33PCB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27S33PCB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
53S441J883B | OTP ROM, 1KX4, 55ns, CMOS, CDIP18, | Monolithic Memories (RETIRED) | AM27S33PCB vs 53S441J883B |
53S441J | OTP ROM, 1KX4, 55ns, CMOS, CDIP18, | Monolithic Memories (RETIRED) | AM27S33PCB vs 53S441J |
53S440J883B | OTP ROM, 1KX4, 55ns, CMOS, CDIP18, | Monolithic Memories (RETIRED) | AM27S33PCB vs 53S440J883B |
AM27S33PC | OTP ROM, 1KX4, 55ns, Bipolar, PDIP18, PLASTIC, DIP-18 | AMD | AM27S33PCB vs AM27S33PC |
AM27S33DCB | OTP ROM, 1KX4, 55ns, Bipolar, CDIP18, CERAMIC, DIP-18 | AMD | AM27S33PCB vs AM27S33DCB |
AM27S32PCB | OTP ROM, 1KX4, 55ns, Bipolar, PDIP18, PLASTIC, DIP-18 | AMD | AM27S33PCB vs AM27S32PCB |
AM27S33DC | OTP ROM, 1KX4, 55ns, Bipolar, CDIP18, CERAMIC, DIP-18 | AMD | AM27S33PCB vs AM27S33DC |
AM27S32PC | OTP ROM, 1KX4, 55ns, Bipolar, PDIP18, PLASTIC, DIP-18 | AMD | AM27S33PCB vs AM27S32PC |
AM27S32DCB | OTP ROM, 1KX4, 55ns, Bipolar, CDIP18, HERMETIC SEALED, CERAMIC, DIP-18 | AMD | AM27S33PCB vs AM27S32DCB |
AM27S32DC | OTP ROM, 1KX4, 55ns, Bipolar, CDIP18, HERMETIC SEALED, CERAMIC, DIP-18 | AMD | AM27S33PCB vs AM27S32DC |