Part Details for AM27S31APC by AMD
Overview of AM27S31APC by AMD
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (5 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Price & Stock for AM27S31APC
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 3 |
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RFQ |
Part Details for AM27S31APC
AM27S31APC CAD Models
AM27S31APC Part Data Attributes:
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AM27S31APC
AMD
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Datasheet
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AM27S31APC
AMD
OTP ROM, 512X8, 35ns, Bipolar, PDIP24, PLASTIC, DIP-24
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Part Package Code | DIP | |
| Package Description | DIP, DIP24,.6 | |
| Pin Count | 24 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 35 ns | |
| JESD-30 Code | R-PDIP-T24 | |
| JESD-609 Code | e0 | |
| Length | 32.004 mm | |
| Memory Density | 4096 bit | |
| Memory IC Type | OTP ROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 512 words | |
| Number of Words Code | 512 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 75 °C | |
| Operating Temperature-Min | ||
| Organization | 512X8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP24,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.715 mm | |
| Supply Current-Max | 0.175 mA | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | BIPOLAR | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for AM27S31APC
This table gives cross-reference parts and alternative options found for AM27S31APC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27S31APC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AM27S31ADCB | OTP ROM, 512X8, 35ns, Bipolar, CDIP24, CERAMIC, DIP-24 | AMD | AM27S31APC vs AM27S31ADCB |
| 53RA481JS883B | OTP ROM, 512X8, 35ns, CMOS, CDIP24, | Monolithic Memories (RETIRED) | AM27S31APC vs 53RA481JS883B |
| AM27S31APCB | OTP ROM, 512X8, 35ns, Bipolar, PDIP24, PLASTIC, DIP-24 | AMD | AM27S31APC vs AM27S31APCB |
| AM27S31ADC | OTP ROM, 512X8, 35ns, Bipolar, CDIP24, CERAMIC, DIP-24 | AMD | AM27S31APC vs AM27S31ADC |
| DM74S474BN | IC 512 X 8 OTPROM, 35 ns, PDIP24, PLASTIC, DIP-24, Programmable ROM | National Semiconductor Corporation | AM27S31APC vs DM74S474BN |