Part Details for AM27C256-200DEB by AMD
Overview of AM27C256-200DEB by AMD
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| AM27C256-55DM/B | Rochester Electronics | AM27C256 - 256K (32KX8) CMOS EPROM | |
| AM27C256-120PC-G | Rochester Electronics | AM27C256 - 256Kb (32K x 8-Bit) CMOS OTP EPROM | |
| AM27C256-150DI | Rochester Electronics LLC | Replacement for AMD part number AM27C256-150DI. Buy from authorized manufacturer Rochester Electronics. |
Part Details for AM27C256-200DEB
AM27C256-200DEB CAD Models
AM27C256-200DEB Part Data Attributes
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AM27C256-200DEB
AMD
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Datasheet
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AM27C256-200DEB
AMD
UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Part Package Code | DIP | |
| Package Description | WDIP, DIP28,.6 | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 200 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-CDIP-T28 | |
| JESD-609 Code | e0 | |
| Length | 37.1475 mm | |
| Memory Density | 262144 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 32KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | WDIP | |
| Package Equivalence Code | DIP28,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE, WINDOW | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 12.75 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.588 mm | |
| Standby Current-Max | 0.0001 A | |
| Supply Current-Max | 0.025 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for AM27C256-200DEB
This table gives cross-reference parts and alternative options found for AM27C256-200DEB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27C256-200DEB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| TMS27C256-2JE4 | 262 144-Bitprogrammable Read-Only Memory 28-CDIP | Texas Instruments | AM27C256-200DEB vs TMS27C256-2JE4 |
| MBM27C256A-20WZ | 32KX8 UVPROM, 200ns, CDIP28, CERDIP-28 | FUJITSU Limited | AM27C256-200DEB vs MBM27C256A-20WZ |
| NMC27C256BQM200 | IC 32K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM | National Semiconductor Corporation | AM27C256-200DEB vs NMC27C256BQM200 |
| NM27C256QM200 | IC 32K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERDIP-28, Programmable ROM | National Semiconductor Corporation | AM27C256-200DEB vs NM27C256QM200 |
| NMC27C256QE200 | 32KX8 UVPROM, 200ns, CDIP28, WINDOWED, CERAMIC, DIP-28 | Texas Instruments | AM27C256-200DEB vs NMC27C256QE200 |
| 27C256-20I/J | 32K X 8 UVPROM, 200 ns, CDIP28, 0.600 INCH, CERDIP-28 | Microchip Technology Inc | AM27C256-200DEB vs 27C256-20I/J |
| NMC27C256Q20 | IC 32K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM | Texas Instruments | AM27C256-200DEB vs NMC27C256Q20 |
| M27C256B-20XF7 | 32KX8 UVPROM, 200ns, CDIP28, FRIT SEALED, WINDOWED, CERAMIC, DIP-28 | STMicroelectronics | AM27C256-200DEB vs M27C256B-20XF7 |
| AM27C256-200DEB | UVPROM, 32KX8, 200ns, CMOS, CDIP28, DIP-28 | Spansion | AM27C256-200DEB vs AM27C256-200DEB |
| TMS27C256-2JE | 262 144-Bitprogrammable Read-Only Memory 28-CDIP -40 to 85 | Texas Instruments | AM27C256-200DEB vs TMS27C256-2JE |