Datasheets
AM27C1024DC by: AMD

UVPROM, 64KX16, 250ns, CMOS, CDIP40, HERMETIC SEALED, CERAMIC, DIP-40

Part Details for AM27C1024DC by AMD

Overview of AM27C1024DC by AMD

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Applications Industrial Automation Computing and Data Storage Financial Technology (Fintech) Telecommunications

Part Details for AM27C1024DC

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AM27C1024DC Part Data Attributes

AM27C1024DC AMD
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AM27C1024DC AMD UVPROM, 64KX16, 250ns, CMOS, CDIP40, HERMETIC SEALED, CERAMIC, DIP-40
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Part Package Code DIP
Package Description WDIP, DIP40,.6
Pin Count 40
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.61
Access Time-Max 250 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T40
JESD-609 Code e0
Length 52.2605 mm
Memory Density 1048576 bit
Memory IC Type UVPROM
Memory Width 16
Number of Functions 1
Number of Terminals 40
Number of Words 65536 words
Number of Words Code 64000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 64KX16
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code WDIP
Package Equivalence Code DIP40,.6
Package Shape RECTANGULAR
Package Style IN-LINE, WINDOW
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.588 mm
Supply Current-Max 0.05 mA
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for AM27C1024DC

This table gives cross-reference parts and alternative options found for AM27C1024DC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27C1024DC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
M27C1024-25XF1 64KX16 UVPROM, 250ns, CDIP40, WINDOWED, FRIT SEALED, CERAMIC, DIP-40 STMicroelectronics AM27C1024DC vs M27C1024-25XF1
TMS27C210-250JL 64KX16 UVPROM, 250ns, CDIP40, WINDOWED, CERDIP-40 Texas Instruments AM27C1024DC vs TMS27C210-250JL
TMS27C210A-250JL 64KX16 UVPROM, 250ns, CDIP40, 0.600 INCH, WINDOWED, CERAMIC, DIP-40 Texas Instruments AM27C1024DC vs TMS27C210A-250JL
Part Number Description Manufacturer Compare
NMC27C1024V120 64KX16 UVPROM, 120ns, PQCC44, PLASTIC, LCC-44 Texas Instruments AM27C1024DC vs NMC27C1024V120
M27V102-200F6 64KX16 UVPROM, 200ns, CDIP40, FRIT SEALED, WINDOWED, CERAMIC, DIP-40 STMicroelectronics AM27C1024DC vs M27V102-200F6
NM27P210QE150 IC 64K X 16 UVPROM, 150 ns, CDIP40, WINDOWED, CERAMIC, DIP-40, Programmable ROM National Semiconductor Corporation AM27C1024DC vs NM27P210QE150
5962-8680508QC UVPROM, 64KX16, 70ns, CMOS, CDIP40, 0.600 INCH, WINDOWED, CERDIP-40 Atmel Corporation AM27C1024DC vs 5962-8680508QC
NMC27C1024VE150 64KX16 UVPROM, 150ns, PQCC44, PLASTIC, LCC-44 Texas Instruments AM27C1024DC vs NMC27C1024VE150
NMC27C1024Q150 IC 64K X 16 UVPROM, 150 ns, CDIP40, CERAMIC, DIP-40, Programmable ROM National Semiconductor Corporation AM27C1024DC vs NMC27C1024Q150
27C1024MQ20 UVPROM, 64KX16, 200ns, CMOS, CDIP40, WINDOWED, CERDIP-40 Teledyne e2v AM27C1024DC vs 27C1024MQ20
NMC27C1024V25 64KX16 UVPROM, 250ns, PQCC44, PLASTIC, LCC-44 Texas Instruments AM27C1024DC vs NMC27C1024V25
AM27C1024-255DEB UVPROM, 64KX16, 250ns, CMOS, CDIP40, WINDOWED, CERAMIC, DIP-40 AMD AM27C1024DC vs AM27C1024-255DEB
AM27C1024DCB UVPROM, 64KX16, 250ns, CMOS, CDIP40, HERMETIC SEALED, CERAMIC, DIP-40 AMD AM27C1024DC vs AM27C1024DCB

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