Memory
AM2732B-250DE
AMD
Description: UVPROM, 4KX8, 250ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24

Overview of AM2732B-250DE by AMD

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Where used in Applications: Consumer Electronics

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Part Data Attributes for AM2732B-250DE by AMD

AM2732B-250DE
AMD
-
-
Pbfree Code
No
Rohs Code
No
Part Life Cycle Code
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
Part Package Code
DIP
Package Description
WDIP, DIP24,.6
Pin Count
24
Reach Compliance Code
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.61
Access Time-Max
250 ns
I/O Type
COMMON
JESD-30 Code
R-GDIP-T24
JESD-609 Code
e0
Length
32.0675 mm
Memory Density
32768 bit
Memory IC Type
UVPROM
Memory Width
8
Number of Functions
1
Number of Terminals
24
Number of Words
4096 words
Number of Words Code
4000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
4KX8
Output Characteristics
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
Package Code
WDIP
Package Equivalence Code
DIP24,.6
Package Shape
RECTANGULAR
Package Style
IN-LINE, WINDOW
Parallel/Serial
PARALLEL
Programming Voltage
12.5 V
Qualification Status
Not Qualified
Seated Height-Max
5.588 mm
Supply Current-Max
0.1 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
NMOS
Temperature Grade
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Width
15.24 mm
Want to compare parts?
  1. AM2732B-250DE
    AMD
    UVPROM, 4KX8, 250ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24
    VS

Alternate Parts for AM2732B-250DE

This table gives cross-reference parts and alternative options found for AM2732B-250DE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM2732B-250DE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
AM2732BDI UVPROM, 4KX8, 250ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 AMD AM2732B-250DE vs AM2732BDI
AM2732B-250DI UVPROM, 4KX8, 250ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 AMD AM2732B-250DE vs AM2732B-250DI
LD2732A-25 UVPROM, 4KX8, 250ns, HMOS, CDIP24, CERAMIC, DIP-24 Intel Corporation AM2732B-250DE vs LD2732A-25
M2732AF1 4KX8 UVPROM, 250ns, CDIP24, WINDOWED, FRIT SEALED, CERAMIC, DIP-24 STMicroelectronics AM2732B-250DE vs M2732AF1
TD2732A-2 UVPROM, 4KX8, 250ns, HMOS, CDIP24, CERAMIC, DIP-24 Intel Corporation AM2732B-250DE vs TD2732A-2
NMC27C32BQE250 IC 4K X 8 UVPROM, 250 ns, CDIP24, WINDOWED, CERAMIC, DIP-24, Programmable ROM National Semiconductor Corporation AM2732B-250DE vs NMC27C32BQE250
M2732AF6 4KX8 UVPROM, 250ns, CDIP24, WINDOWED, FRIT SEALED, CERAMIC, DIP-24 STMicroelectronics AM2732B-250DE vs M2732AF6
QD2732A-25 UVPROM, 4KX8, 250ns, NMOS, CDIP24, CERDIP-24 Intel Corporation AM2732B-250DE vs QD2732A-25
QD2732A UVPROM, 4KX8, 250ns, NMOS, CDIP24, CERDIP-24 Intel Corporation AM2732B-250DE vs QD2732A
NMC27C32BQ250 IC 4K X 8 UVPROM, 250 ns, CDIP24, WINDOWED, CERAMIC, DIP-24, Programmable ROM National Semiconductor Corporation AM2732B-250DE vs NMC27C32BQ250
Part Number Description Manufacturer Compare
LD2732A-20 UVPROM, 4KX8, 250ns, HMOS, CDIP24, CERAMIC, DIP-24 Intel Corporation AM2732B-250DE vs LD2732A-20
S6333M-P MASK ROM, 4KX8, 175ns, CMOS, PDIP24 Gould Ami AM2732B-250DE vs S6333M-P
TMS2732A-17JP4 4KX8 UVPROM, 170ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 Texas Instruments AM2732B-250DE vs TMS2732A-17JP4
S63332C-C MASK ROM, 4KX8, 120ns, CMOS, CDIP24 Gould Ami AM2732B-250DE vs S63332C-C
8001209JX UVPROM, 4KX8, 250ns, NMOS, 1.290 X 0.610 INCH, 0.225 INCH HEIGHT, DIP-24 AMD AM2732B-250DE vs 8001209JX
5962-9065801LA UVPROM, 4KX8, 70ns, CMOS, CDIP24, CERAMIC, DIP-24 Waferscale Integration Inc AM2732B-250DE vs 5962-9065801LA
TMS27C32-12JE 4KX8 UVPROM, 120ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 Texas Instruments AM2732B-250DE vs TMS27C32-12JE
HI1837C-P-000 MASK ROM, 4KX8, 1375ns, CMOS, PDIP24 Hughes Aircraft AM2732B-250DE vs HI1837C-P-000
TMS27C32-10JE4 4KX8 UVPROM, 100ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 Texas Instruments AM2732B-250DE vs TMS27C32-10JE4
TMS27C32-25JL4 4KX8 UVPROM, 250ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 Texas Instruments AM2732B-250DE vs TMS27C32-25JL4

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