AM2732B-250DE vs 5962-9065801LA feature comparison

AM2732B-250DE AMD

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5962-9065801LA Waferscale Integration Inc

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC WAFERSCALE INTEGRATION INC
Part Package Code DIP
Package Description WDIP, DIP24,.6 CERAMIC, DIP-24
Pin Count 24
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 250 ns 70 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T24 R-GDIP-T24
JESD-609 Code e0 e0
Length 32.0675 mm
Memory Density 32768 bit 32768 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 4KX8 4KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code WDIP DIP
Package Equivalence Code DIP24,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE, WINDOW IN-LINE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 12.5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.588 mm
Supply Current-Max 0.1 mA 0.035 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology NMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm
Base Number Matches 1 1

Compare AM2732B-250DE with alternatives

Compare 5962-9065801LA with alternatives