Part Details for 74LVC16373ADGG,112 by NXP Semiconductors
Results Overview of 74LVC16373ADGG,112 by NXP Semiconductors
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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74LVC16373ADGG,112 Information
74LVC16373ADGG,112 by NXP Semiconductors is a Bus Driver/Transceiver.
Bus Driver/Transceivers are under the broader part category of Logic Components.
Digital logic governs the behavior of signals in electronic circuits, enabling complex decisions based on simple binary inputs (yes/no). Logic components perform operations from these signals. Read more about Logic Components on our Logic part category page.
Price & Stock for 74LVC16373ADGG,112
Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Logic ICs | 10 |
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RFQ |
Part Details for 74LVC16373ADGG,112
74LVC16373ADGG,112 CAD Models
74LVC16373ADGG,112 Part Data Attributes
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74LVC16373ADGG,112
NXP Semiconductors
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74LVC16373ADGG,112
NXP Semiconductors
74LVC(H)16373A - 16-bit D-type transparent latch with 5 V tolerant inputs/outputs; 3-state TSSOP 48-Pin
Select a part to compare: |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | TSSOP | |
Package Description | 6.10 MM, PLASTIC, MO-153, SOT-362-1, TSSOP-48 | |
Pin Count | 48 | |
Manufacturer Package Code | SOT362-1 | |
Reach Compliance Code | compliant | |
Factory Lead Time | 4 Weeks | |
Family | LVC/LCX/Z | |
JESD-30 Code | R-PDSO-G48 | |
JESD-609 Code | e4 | |
Length | 12.5 mm | |
Logic IC Type | BUS DRIVER | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 2 | |
Number of Ports | 2 | |
Number of Terminals | 48 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Output Characteristics | 3-STATE | |
Output Polarity | TRUE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSSOP | |
Package Equivalence Code | TSSOP48,.3,20 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
Packing Method | TUBE | |
Peak Reflow Temperature (Cel) | 260 | |
Propagation Delay (tpd) | 7 ns | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.2 mm | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 1.2 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | NICKEL PALLADIUM GOLD | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.5 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 6.1 mm |