| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 72V273L7-5BCGI8 | Renesas Electronics Corporation | 16K x 18 / 32K x 9 SuperSync II FIFO, 3.3V | |
| 72V273L7-5PFGI8 | Renesas Electronics Corporation | 16K x 18 / 32K x 9 SuperSync II FIFO, 3.3V | |
| 72V273L7-5PF | Renesas Electronics Corporation | 16K x 18 / 32K x 9 SuperSync II FIFO, 3.3V |
|
|
|
|---|---|
|
Pbfree Code
|
Yes
|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
RENESAS ELECTRONICS CORP
|
|
Part Package Code
|
CABGA
|
|
Package Description
|
11 X 11 MM, 1 MM PITCH, GREEN, BGA-100
|
|
Pin Count
|
100
|
|
Manufacturer Package Code
|
BCG100
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
NLR
|
|
HTS Code
|
8542320071
|
|
Samacsys Manufacturer
|
Renesas Electronics
|
|
Access Time-Max
|
5 ns
|
|
Additional Feature
|
IT CAN ALSO BE CONFIGURED AS 32K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE
|
|
Alternate Memory Width
|
9
|
|
Clock Frequency-Max (fCLK)
|
133.3 MHz
|
|
Cycle Time
|
7.5 ns
|
|
JESD-30 Code
|
S-PBGA-B100
|
|
JESD-609 Code
|
e1
|
|
Length
|
11 mm
|
|
Memory Density
|
294912 bit
|
|
Memory IC Type
|
OTHER FIFO
|
|
Memory Width
|
18
|
|
Moisture Sensitivity Level
|
3
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
100
|
|
Number of Words
|
16384 words
|
|
Number of Words Code
|
16000
|
|
Operating Mode
|
SYNCHRONOUS
|
|
Operating Temperature-Max
|
85 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
Organization
|
16KX18
|
|
Output Enable
|
YES
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
LBGA
|
|
Package Equivalence Code
|
BGA100,10X10,40
|
|
Package Shape
|
SQUARE
|
|
Package Style
|
GRID ARRAY, LOW PROFILE
|
|
Parallel/Serial
|
PARALLEL
|
|
Peak Reflow Temperature (Cel)
|
260
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
1.5 mm
|
|
Standby Current-Max
|
0.015 A
|
|
Supply Current-Max
|
0.035 mA
|
|
Supply Voltage-Max (Vsup)
|
3.45 V
|
|
Supply Voltage-Min (Vsup)
|
3.15 V
|
|
Supply Voltage-Nom (Vsup)
|
3.3 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
INDUSTRIAL
|
|
Terminal Finish
|
TIN SILVER COPPER
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
1 mm
|
|
Terminal Position
|
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
|
Width
|
11 mm
|
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 72V273L7-5BCG8 | FIFO, 16KX18, 5ns, Synchronous, CMOS, PBGA100, 11 X 11 MM, 1 MM PITCH, GREEN, BGA-100 | Integrated Device Technology Inc | 72V273L7-5BCGI8 vs 72V273L7-5BCG8 |
| 72V273L7-5BCGI8 | CABGA-100, Reel | Integrated Device Technology Inc | 72V273L7-5BCGI8 vs 72V273L7-5BCGI8 |
| 72V273L7-5BCI | CABGA-100, Tray | Integrated Device Technology Inc | 72V273L7-5BCGI8 vs 72V273L7-5BCI |
| 72V273L7-5BC | 16K x 18 / 32K x 9 SuperSync II FIFO, 3.3V, CABGA168/Tray | Renesas Electronics Corporation | 72V273L7-5BCGI8 vs 72V273L7-5BC |
| IDT72V273L7-5BC | FIFO, 16KX18, 5ns, Synchronous, CMOS, PBGA100, 11 X 11 MM, 1 MM PITCH, BGA-100 | Integrated Device Technology Inc | 72V273L7-5BCGI8 vs IDT72V273L7-5BC |
| 72V273L7-5BCGI | CABGA-100, Tray | Integrated Device Technology Inc | 72V273L7-5BCGI8 vs 72V273L7-5BCGI |
| IDT72V273L7-5BCI | FIFO, 16KX18, 5ns, Synchronous, CMOS, PBGA100, 11 X 11 MM, 1 MM PITCH, BGA-100 | Integrated Device Technology Inc | 72V273L7-5BCGI8 vs IDT72V273L7-5BCI |
| IDT72V273L7-5BCGI8 | FIFO, 16KX18, 5ns, Synchronous, CMOS, PBGA100, 11 X 11 MM, 1 MM PITCH, GREEN, BGA-100 | Integrated Device Technology Inc | 72V273L7-5BCGI8 vs IDT72V273L7-5BCGI8 |
| 72V273L7-5BCGI | 16K x 18 / 32K x 9 SuperSync II FIFO, 3.3V, CABGA168/Tray | Renesas Electronics Corporation | 72V273L7-5BCGI8 vs 72V273L7-5BCGI |
| IDT72V273L7-5BCG | FIFO, 16KX18, 5ns, Synchronous, CMOS, PBGA100, 11 X 11 MM, 1 MM PITCH, GREEN, BGA-100 | Integrated Device Technology Inc | 72V273L7-5BCGI8 vs IDT72V273L7-5BCG |
