72V273L7-5BCGI8 vs IDT72V273L7-5BCGI8 feature comparison

72V273L7-5BCGI8 Renesas Electronics Corporation

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IDT72V273L7-5BCGI8 Integrated Device Technology Inc

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer RENESAS ELECTRONICS CORP INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code CABGA BGA
Package Description 11 X 11 MM, 1 MM PITCH, GREEN, BGA-100 LBGA, BGA100,10X10,40
Pin Count 100 100
Manufacturer Package Code BCG100
Reach Compliance Code compliant compliant
ECCN Code NLR EAR99
HTS Code 8542320071 8542.32.00.71
Samacsys Manufacturer Renesas Electronics
Access Time-Max 5 ns 5 ns
Additional Feature IT CAN ALSO BE CONFIGURED AS 32K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE IT CAN ALSO BE CONFIGURED AS 32K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE
Alternate Memory Width 9 9
Clock Frequency-Max (fCLK) 133.3 MHz 133.3 MHz
Cycle Time 7.5 ns 7.5 ns
JESD-30 Code S-PBGA-B100 S-PBGA-B100
JESD-609 Code e1 e1
Length 11 mm 11 mm
Memory Density 294912 bit 294912 bit
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 18 18
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 100 100
Number of Words 16384 words 16384 words
Number of Words Code 16000 16000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 16KX18 16KX18
Output Enable YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA100,10X10,40 BGA100,10X10,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 1.5 mm
Standby Current-Max 0.015 A 0.015 A
Supply Current-Max 0.035 mA 0.035 mA
Supply Voltage-Max (Vsup) 3.45 V 3.45 V
Supply Voltage-Min (Vsup) 3.15 V 3.15 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 11 mm 11 mm
Base Number Matches 1 1
Date Of Intro 1998-11-01

Compare 72V273L7-5BCGI8 with alternatives

Compare IDT72V273L7-5BCGI8 with alternatives