Part Details for 71V3577S75BQG8 by Integrated Device Technology Inc
Overview of 71V3577S75BQG8 by Integrated Device Technology Inc
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Part Details for 71V3577S75BQG8
71V3577S75BQG8 CAD Models
71V3577S75BQG8 Part Data Attributes:
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71V3577S75BQG8
Integrated Device Technology Inc
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Datasheet
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71V3577S75BQG8
Integrated Device Technology Inc
CABGA-165, Reel
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
Part Package Code | CABGA | |
Package Description | ROHS COMPLIANT, FBGA-165 | |
Pin Count | 165 | |
Manufacturer Package Code | BQG165 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Date Of Intro | 1997-09-16 | |
Access Time-Max | 7.5 ns | |
Additional Feature | FLOW THROUGH ARCHITECTURE | |
JESD-30 Code | R-PBGA-B165 | |
JESD-609 Code | e1 | |
Length | 15 mm | |
Memory Density | 4718592 bit | |
Memory IC Type | CACHE SRAM | |
Memory Width | 36 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 165 | |
Number of Words | 131072 words | |
Number of Words Code | 128000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 128KX36 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 1.2 mm | |
Supply Voltage-Max (Vsup) | 3.465 V | |
Supply Voltage-Min (Vsup) | 3.135 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 13 mm |