Memory
71T75602S200BGI
Integrated Device Technology Inc
Description: ZBT SRAM, 512KX36, 3.2ns, CMOS, PBGA119, 14 X 22 MM, MS-028AA, BGA-119

Overview of 71T75602S200BGI by Integrated Device Technology Inc

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Where used in Applications: Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

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Part Data Attributes for 71T75602S200BGI by Integrated Device Technology Inc

71T75602S200BGI
Integrated Device Technology Inc
-
-
Rohs Code
No
Part Life Cycle Code
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
Package Description
14 X 22 MM, MS-028AA, BGA-119
Pin Count
119
Reach Compliance Code
not_compliant
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Access Time-Max
3.2 ns
Additional Feature
PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK)
200 MHz
I/O Type
COMMON
JESD-30 Code
R-PBGA-B119
JESD-609 Code
e0
Length
22 mm
Memory Density
18874368 bit
Memory IC Type
ZBT SRAM
Memory Width
36
Moisture Sensitivity Level
3
Number of Functions
1
Number of Terminals
119
Number of Words
524288 words
Number of Words Code
512000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
512KX36
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
BGA
Package Equivalence Code
BGA119,7X17,50
Package Shape
RECTANGULAR
Package Style
GRID ARRAY
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
225
Qualification Status
Not Qualified
Seated Height-Max
2.36 mm
Standby Voltage-Min
2.38 V
Supply Voltage-Max (Vsup)
2.625 V
Supply Voltage-Min (Vsup)
2.375 V
Supply Voltage-Nom (Vsup)
2.5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
Terminal Pitch
1.27 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
Width
14 mm
Want to compare parts?
  1. 71T75602S200BGI
    Integrated Device Technology Inc
    ZBT SRAM, 512KX36, 3.2ns, CMOS, PBGA119, 14 X 22 MM, MS-028AA, BGA-119
    VS

Alternate Parts for 71T75602S200BGI

This table gives cross-reference parts and alternative options found for 71T75602S200BGI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 71T75602S200BGI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
71T75602S200BGGI8 ZBT SRAM, 512KX36, 3.2ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, MS-028AA, BGA-119 Integrated Device Technology Inc 71T75602S200BGI vs 71T75602S200BGGI8
71T75602S166BGI 2.5V 512K X 36 ZBT Synchronous 2.5V I/O PipeLine SRAM, PBGA84/Tray Renesas Electronics Corporation 71T75602S200BGI vs 71T75602S166BGI
CY7C1370BV25-200BGC ZBT SRAM, 512KX36, 3ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 Cypress Semiconductor 71T75602S200BGI vs CY7C1370BV25-200BGC
KM736S949H-60 ZBT SRAM, 512KX36, 3.5ns, CMOS, PBGA119, BGA-119 Samsung Semiconductor 71T75602S200BGI vs KM736S949H-60
IDT71T75602S166BGI8 ZBT SRAM, 512KX36, 3.5ns, CMOS, PBGA119, 14 X 22 MM, MS-028-AA, BGA-119 Integrated Device Technology Inc 71T75602S200BGI vs IDT71T75602S166BGI8
71T75602S166BGGI PBGA-119, Tray Integrated Device Technology Inc 71T75602S200BGI vs 71T75602S166BGGI
71T75602S200BGG ZBT SRAM, 512KX36, PBGA119, 14 X 22 MM, GREEN, MS-028AA, BGA-119 Integrated Device Technology Inc 71T75602S200BGI vs 71T75602S200BGG
IDT71T75602S200BG ZBT SRAM, 512KX36, 3.2ns, CMOS, PBGA119, 14 X 22 MM, MS-028-AA, BGA-119 Integrated Device Technology Inc 71T75602S200BGI vs IDT71T75602S200BG
71T75602S200BG8 ZBT SRAM, 512KX36, 3.2ns, CMOS, PBGA119, 14 X 22 MM, MS-028-AA, BGA-119 Integrated Device Technology Inc 71T75602S200BGI vs 71T75602S200BG8
IDT71T75602S166BGG ZBT SRAM, 512KX36, 3.5ns, CMOS, PBGA119, 14 X 22 MM, MS-028-AA, BGA-119 Integrated Device Technology Inc 71T75602S200BGI vs IDT71T75602S166BGG
Part Number Description Manufacturer Compare
IDT71T75602S166BGI ZBT SRAM, 512KX36, 3.5ns, CMOS, PBGA119, 14 X 22 MM, MS-028-AA, BGA-119 Integrated Device Technology Inc 71T75602S200BGI vs IDT71T75602S166BGI
71T75602S166BGGI8 2.5V 512K X 36 ZBT Synchronous 2.5V I/O PipeLine SRAM, PBGA0/Reel Renesas Electronics Corporation 71T75602S200BGI vs 71T75602S166BGGI8
CY7C1370DV25-200BGI ZBT SRAM, 512KX36, 3ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, BGA-119 Cypress Semiconductor 71T75602S200BGI vs CY7C1370DV25-200BGI
71T75602S150PFG 2.5V 512K X 36 ZBT Synchronous 2.5V I/O PipeLine SRAM, TQFP72/Tray Renesas Electronics Corporation 71T75602S200BGI vs 71T75602S150PFG
71T75602S150BGI8 2.5V 512K X 36 ZBT Synchronous 2.5V I/O PipeLine SRAM, PBGA0/Reel Renesas Electronics Corporation 71T75602S200BGI vs 71T75602S150BGI8
IDT71T75602S200BGGI ZBT SRAM, 512KX36, 3.2ns, CMOS, PBGA119, 14 X 22 MM, MS-028-AA, BGA-119 Integrated Device Technology Inc 71T75602S200BGI vs IDT71T75602S200BGGI
IDT71T75602S200BGG ZBT SRAM, 512KX36, 3.2ns, CMOS, PBGA119, 14 X 22 MM, MS-028-AA, BGA-119 Integrated Device Technology Inc 71T75602S200BGI vs IDT71T75602S200BGG
71T75602S166BGGI 2.5V 512K X 36 ZBT Synchronous 2.5V I/O PipeLine SRAM, PBGA84/Tray Renesas Electronics Corporation 71T75602S200BGI vs 71T75602S166BGGI
71T75602S133BG8 2.5V 512K X 36 ZBT Synchronous 2.5V I/O PipeLine SRAM, PBGA0/Reel Renesas Electronics Corporation 71T75602S200BGI vs 71T75602S133BG8
CY7C1370DV25-200BGXI ZBT SRAM, 512KX36, 3ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, LEAD FREE, BGA-119 Cypress Semiconductor 71T75602S200BGI vs CY7C1370DV25-200BGXI

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