| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 70T3589S200BC8 | Renesas Electronics Corporation | 64K x 36 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O's |
|
|
|
|---|---|
|
Pbfree Code
|
No
|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
RENESAS ELECTRONICS CORP
|
|
Part Package Code
|
CABGA
|
|
Pin Count
|
256
|
|
Manufacturer Package Code
|
BC256
|
|
Reach Compliance Code
|
not_compliant
|
|
ECCN Code
|
NLR
|
|
HTS Code
|
8542320041
|
|
Samacsys Manufacturer
|
Renesas Electronics
|
|
Access Time-Max
|
10 ns
|
|
Additional Feature
|
FLOW-THROUGH OR PIPELINED ARCHITECTURE
|
|
Clock Frequency-Max (fCLK)
|
200 MHz
|
|
I/O Type
|
COMMON
|
|
JESD-30 Code
|
S-PBGA-B256
|
|
JESD-609 Code
|
e0
|
|
Length
|
17 mm
|
|
Memory Density
|
2359296 bit
|
|
Memory IC Type
|
MULTI-PORT SRAM
|
|
Memory Width
|
36
|
|
Moisture Sensitivity Level
|
3
|
|
Number of Functions
|
1
|
|
Number of Ports
|
2
|
|
Number of Terminals
|
256
|
|
Number of Words
|
65536 words
|
|
Number of Words Code
|
64000
|
|
Operating Mode
|
SYNCHRONOUS
|
|
Operating Temperature-Max
|
70 °C
|
|
Operating Temperature-Min
|
|
|
Organization
|
64KX36
|
|
Output Characteristics
|
3-STATE
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
LBGA
|
|
Package Equivalence Code
|
BGA256,16X16,40
|
|
Package Shape
|
SQUARE
|
|
Package Style
|
GRID ARRAY, LOW PROFILE
|
|
Parallel/Serial
|
PARALLEL
|
|
Peak Reflow Temperature (Cel)
|
225
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
1.5 mm
|
|
Standby Current-Max
|
0.015 A
|
|
Standby Voltage-Min
|
2.4 V
|
|
Supply Current-Max
|
0.525 mA
|
|
Supply Voltage-Max (Vsup)
|
2.6 V
|
|
Supply Voltage-Min (Vsup)
|
2.4 V
|
|
Supply Voltage-Nom (Vsup)
|
2.5 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
COMMERCIAL
|
|
Terminal Finish
|
TIN LEAD
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
1 mm
|
|
Terminal Position
|
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s)
|
20
|
|
Width
|
17 mm
|
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 70T3589S200BC | CABGA-256, Tray | Integrated Device Technology Inc | 70T3589S200BC8 vs 70T3589S200BC |
| 70T3589S200BC8 | CABGA-256, Reel | Integrated Device Technology Inc | 70T3589S200BC8 vs 70T3589S200BC8 |
| 70T3589S200BCG | Dual-Port SRAM, 64KX36, 10ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, GREEN, BGA-256 | Integrated Device Technology Inc | 70T3589S200BC8 vs 70T3589S200BCG |
| IDT70T3589S200BCG8 | Multi-Port SRAM, 64KX36, 10ns, CMOS, PBGA256 | Integrated Device Technology Inc | 70T3589S200BC8 vs IDT70T3589S200BCG8 |
| 70T3589S200BC | 64K x 36 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA90/Tray | Renesas Electronics Corporation | 70T3589S200BC8 vs 70T3589S200BC |
| IDT70T3589S200BC | Dual-Port SRAM, 64KX36, 10ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 | Integrated Device Technology Inc | 70T3589S200BC8 vs IDT70T3589S200BC |
