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Part Details for 70V659S10BC8 by Renesas Electronics Corporation
Overview of 70V659S10BC8 by Renesas Electronics Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Internet of Things (IoT)
Environmental Monitoring
Industrial Automation
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Electronic Manufacturing
Entertainment and Gaming
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 70V659S10BC8 | Renesas Electronics Corporation | 128K x 36 3.3V Dual-Port RAM, Interleaved I/O's |
Part Details for 70V659S10BC8
70V659S10BC8 CAD Models
70V659S10BC8 Part Data Attributes
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70V659S10BC8
Renesas Electronics Corporation
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Datasheet
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70V659S10BC8
Renesas Electronics Corporation
128K x 36 3.3V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Part Package Code | CABGA | |
| Pin Count | 256 | |
| Manufacturer Package Code | BC256 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | NLR | |
| HTS Code | 8542320041 | |
| Samacsys Manufacturer | Renesas Electronics | |
| Access Time-Max | 10 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | S-PBGA-B256 | |
| JESD-609 Code | e0 | |
| Length | 17 mm | |
| Memory Density | 4718592 bit | |
| Memory IC Type | MULTI-PORT SRAM | |
| Memory Width | 36 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Ports | 2 | |
| Number of Terminals | 256 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 128KX36 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 225 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.5 mm | |
| Standby Current-Max | 0.015 A | |
| Standby Voltage-Min | 3.15 V | |
| Supply Current-Max | 0.5 mA | |
| Supply Voltage-Max (Vsup) | 3.45 V | |
| Supply Voltage-Min (Vsup) | 3.15 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 20 | |
| Width | 17 mm |
Alternate Parts for 70V659S10BC8
This table gives cross-reference parts and alternative options found for 70V659S10BC8. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 70V659S10BC8, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 70T659S10BCI | 128K x 36 Async, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA90/Tray | Renesas Electronics Corporation | 70V659S10BC8 vs 70T659S10BCI |
| 70V659S10BCG | 128K x 36 3.3V Dual-Port RAM, Interleaved I/O''s, CABGA90/Tray | Renesas Electronics Corporation | 70V659S10BC8 vs 70V659S10BCG |
| 70T659S10BC8 | 128K x 36 Async, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel | Renesas Electronics Corporation | 70V659S10BC8 vs 70T659S10BC8 |
| 70V659S10BC8 | CABGA-256, Reel | Integrated Device Technology Inc | 70V659S10BC8 vs 70V659S10BC8 |
| 70T659S10BCI8 | 128K x 36 Async, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel | Renesas Electronics Corporation | 70V659S10BC8 vs 70T659S10BCI8 |
| IDT70T659S10BCGI | Dual-Port SRAM, 128KX36, 10ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM PITCH, GREEN, BGA-256 | Integrated Device Technology Inc | 70V659S10BC8 vs IDT70T659S10BCGI |
| IDT70T659S10BCI8 | Dual-Port SRAM, 128KX36, 10ns, CMOS, PBGA256, BGA-256 | Integrated Device Technology Inc | 70V659S10BC8 vs IDT70T659S10BCI8 |
| 70T659S10BCI | CABGA-256, Tray | Integrated Device Technology Inc | 70V659S10BC8 vs 70T659S10BCI |
| IDT70V659S10BC8 | Dual-Port SRAM, 128KX36, 10ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 | Integrated Device Technology Inc | 70V659S10BC8 vs IDT70V659S10BC8 |
| 70T659S10BC | 128K x 36 Async, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA90/Tray | Renesas Electronics Corporation | 70V659S10BC8 vs 70T659S10BC |