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128K x 36 3.3V Dual-Port RAM, Interleaved I/O''s, CABGA126/Tray
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part # | Manufacturer | Description | Datasheet |
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70V659S10BFG | Renesas Electronics Corporation | 128K x 36 3.3V Dual-Port RAM, Interleaved I/O's | |
70V659S10BFG8 | Renesas Electronics Corporation | 128K x 36 3.3V Dual-Port RAM, Interleaved I/O's |
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
70V659S10BFG-ND
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DigiKey | IC SRAM 4.5MBIT PAR 208CABGA Min Qty: 21 Lead time: 18 Weeks Container: Tray | Temporarily Out of Stock |
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$206.1043 | Buy Now |
DISTI #
70V659S10BFG
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Avnet Americas | 128K x 36 3.3V Dual-Port RAM, Interleaved I/O's - Trays (Alt: 70V659S10BFG) RoHS: Compliant Min Qty: 21 Package Multiple: 7 Lead time: 18 Weeks, 0 Days Container: Tray | 0 |
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$162.6778 | Buy Now |
DISTI #
972-70V659S10BFG
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Mouser Electronics | SRAM 128Kx36 STD-PWR 3.3V DUAL-PORT RAM RoHS: Compliant | 0 |
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$219.5700 / $252.6900 | Order Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 21 Package Multiple: 7 Lead time: 18 Weeks Container: Tray | 0Tray |
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$190.1500 | Buy Now |
DISTI #
70V659S10BFG
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Avnet Silica | 128K x 36 3.3V Dual-Port RAM, Interleaved I/O's (Alt: 70V659S10BFG) RoHS: Compliant Min Qty: 7 Package Multiple: 7 Lead time: 19 Weeks, 0 Days | Silica - 0 |
|
Buy Now |
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70V659S10BFG
Renesas Electronics Corporation
Buy Now
Datasheet
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Compare Parts:
70V659S10BFG
Renesas Electronics Corporation
128K x 36 3.3V Dual-Port RAM, Interleaved I/O''s, CABGA126/Tray
|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
Part Package Code | CABGA | |
Pin Count | 208 | |
Manufacturer Package Code | BFG208 | |
Reach Compliance Code | compliant | |
ECCN Code | NLR | |
HTS Code | 8542320041 | |
Factory Lead Time | 18 Weeks | |
Samacsys Manufacturer | Renesas Electronics | |
Access Time-Max | 10 ns | |
I/O Type | COMMON | |
JESD-30 Code | S-PBGA-B208 | |
JESD-609 Code | e1 | |
Length | 15 mm | |
Memory Density | 4718592 bit | |
Memory IC Type | MULTI-PORT SRAM | |
Memory Width | 36 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Ports | 2 | |
Number of Terminals | 208 | |
Number of Words | 131072 words | |
Number of Words Code | 128000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 128KX36 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Equivalence Code | BGA208,17X17,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.2 mm | |
Standby Current-Max | 0.015 A | |
Standby Voltage-Min | 3.15 V | |
Supply Current-Max | 0.5 mA | |
Supply Voltage-Max (Vsup) | 3.45 V | |
Supply Voltage-Min (Vsup) | 3.15 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 15 mm |
This table gives cross-reference parts and alternative options found for 70V659S10BFG. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 70V659S10BFG, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
70T659S10BFG | Multi-Port SRAM, 128KX36, 10ns, CMOS, PBGA208 | Integrated Device Technology Inc | 70V659S10BFG vs 70T659S10BFG |
70T659S10BFI | 128K x 36 Async, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA126/Tray | Renesas Electronics Corporation | 70V659S10BFG vs 70T659S10BFI |
70T659S10BFI | CABGA-208, Tray | Integrated Device Technology Inc | 70V659S10BFG vs 70T659S10BFI |
70T659S10BF | CABGA-208, Tray | Integrated Device Technology Inc | 70V659S10BFG vs 70T659S10BF |
IDT70T659S10BFI8 | Dual-Port SRAM, 128KX36, 10ns, CMOS, PBGA208, FBGA-208 | Integrated Device Technology Inc | 70V659S10BFG vs IDT70T659S10BFI8 |
70V659S10BFG8 | 128K x 36 3.3V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel | Renesas Electronics Corporation | 70V659S10BFG vs 70V659S10BFG8 |
70T659S10BFG8 | Multi-Port SRAM, 128KX36, 10ns, CMOS, PBGA208 | Integrated Device Technology Inc | 70V659S10BFG vs 70T659S10BFG8 |
70V659S10BF8 | 128K x 36 3.3V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel | Renesas Electronics Corporation | 70V659S10BFG vs 70V659S10BF8 |
70T659S10BFI8 | 128K x 36 Async, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel | Renesas Electronics Corporation | 70V659S10BFG vs 70T659S10BFI8 |
70T659S10BFGI8 | Application Specific SRAM, 128KX36, 10ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, GREEN, FBGA-208 | Integrated Device Technology Inc | 70V659S10BFG vs 70T659S10BFGI8 |