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64K x 36 Sync, 3.3V Dual-Port RAM, Pipelined/Flow-Through, Interleaved I/O''s, CABGA90/Tray
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
800-2311-ND
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DigiKey | IC SRAM 2MBIT PARALLEL 256CABGA Min Qty: 48 Lead time: 18 Weeks Container: Tray | Limited Supply - Call |
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$169.3092 | Buy Now |
DISTI #
70V3589S166BCG
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Avnet Americas | 64K x 36 Sync, 3.3V Dual-Port RAM, Pipelined/Flow-Through, Interleaved I/O's - Trays (Alt: 70V3589S166BCG) RoHS: Compliant Min Qty: 48 Package Multiple: 6 Container: Tray | 0 |
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$143.0401 / $163.3135 | Buy Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 48 Package Multiple: 6 Lead time: 36 Weeks Container: Tray | 0Tray |
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$144.4000 | Buy Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 48 Package Multiple: 6 Lead time: 36 Weeks Container: Tray | 0Tray |
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$146.2800 | Buy Now |
DISTI #
70V3589S166BCG
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Avnet Silica | 64K x 36 Sync, 3.3V Dual-Port RAM, Pipelined/Flow-Through, Interleaved I/O's (Alt: 70V3589S166BCG) RoHS: Compliant Min Qty: 6 Package Multiple: 6 Lead time: 19 Weeks, 0 Days | Silica - 0 |
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Buy Now |
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70V3589S166BCG
Renesas Electronics Corporation
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Datasheet
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Compare Parts:
70V3589S166BCG
Renesas Electronics Corporation
64K x 36 Sync, 3.3V Dual-Port RAM, Pipelined/Flow-Through, Interleaved I/O''s, CABGA90/Tray
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | End Of Life | |
Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
Part Package Code | CABGA | |
Pin Count | 256 | |
Manufacturer Package Code | BCG256 | |
Reach Compliance Code | compliant | |
ECCN Code | NLR | |
HTS Code | 8542320041 | |
Samacsys Manufacturer | Renesas Electronics | |
Access Time-Max | 12 ns | |
Additional Feature | PIPELINED OR FLOW-THROUGH ARCHITECTURE | |
Clock Frequency-Max (fCLK) | 166 MHz | |
I/O Type | COMMON | |
JESD-30 Code | S-PBGA-B256 | |
JESD-609 Code | e1 | |
Length | 17 mm | |
Memory Density | 2359296 bit | |
Memory IC Type | MULTI-PORT SRAM | |
Memory Width | 36 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Ports | 2 | |
Number of Terminals | 256 | |
Number of Words | 65536 words | |
Number of Words Code | 64000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 64KX36 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.7 mm | |
Standby Current-Max | 0.03 A | |
Standby Voltage-Min | 3.15 V | |
Supply Current-Max | 0.5 mA | |
Supply Voltage-Max (Vsup) | 3.45 V | |
Supply Voltage-Min (Vsup) | 3.15 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 17 mm |
This table gives cross-reference parts and alternative options found for 70V3589S166BCG. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 70V3589S166BCG, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
70V3589S166BC | 64K x 36 Sync, 3.3V Dual-Port RAM, Pipelined/Flow-Through, Interleaved I/O''s, CABGA90/Tray | Renesas Electronics Corporation | 70V3589S166BCG vs 70V3589S166BC |
70T3589S166BCI | Dual-Port SRAM, 64KX36, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 | Integrated Device Technology Inc | 70V3589S166BCG vs 70T3589S166BCI |
IDT70T3589S166BC8 | Dual-Port SRAM, 64KX36, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 | Integrated Device Technology Inc | 70V3589S166BCG vs IDT70T3589S166BC8 |
IDT70T3589S166BCI | Dual-Port SRAM, 64KX36, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 | Integrated Device Technology Inc | 70V3589S166BCG vs IDT70T3589S166BCI |
IDT70V3589S166BC | Dual-Port SRAM, 64KX36, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 | Integrated Device Technology Inc | 70V3589S166BCG vs IDT70V3589S166BC |
IDT70T3589S166BC | Dual-Port SRAM, 64KX36, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 | Integrated Device Technology Inc | 70V3589S166BCG vs IDT70T3589S166BC |
IDT70T3589S166BCG | Dual-Port SRAM, 64KX36, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, GREEN, BGA-256 | Integrated Device Technology Inc | 70V3589S166BCG vs IDT70T3589S166BCG |
70T3589S166BCG | Dual-Port SRAM, 64KX36, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, GREEN, BGA-256 | Integrated Device Technology Inc | 70V3589S166BCG vs 70T3589S166BCG |
70T3589S166BC | CABGA-256, Tray | Integrated Device Technology Inc | 70V3589S166BCG vs 70T3589S166BC |
70T3589S166BC | 64K x 36 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA90/Tray | Renesas Electronics Corporation | 70V3589S166BCG vs 70T3589S166BC |