There are no models available for this part yet.
Overview of IDT70T3589S166BC by Integrated Device Technology Inc
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for IDT70T3589S166BC by Integrated Device Technology Inc
Part Data Attributes for IDT70T3589S166BC by Integrated Device Technology Inc
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|
|
|---|---|
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Pbfree Code
|
No
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|
Rohs Code
|
No
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|
Part Life Cycle Code
|
Transferred
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Ihs Manufacturer
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INTEGRATED DEVICE TECHNOLOGY INC
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Part Package Code
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BGA
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Package Description
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LBGA, BGA256,16X16,40
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Pin Count
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256
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Reach Compliance Code
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not_compliant
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ECCN Code
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3A991.B.2.A
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HTS Code
|
8542.32.00.41
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Access Time-Max
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12 ns
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Additional Feature
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FLOW-THROUGH OR PIPELINED ARCHITECTURE
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Clock Frequency-Max (fCLK)
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166 MHz
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I/O Type
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COMMON
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JESD-30 Code
|
S-PBGA-B256
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JESD-609 Code
|
e0
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Length
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17 mm
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Memory Density
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2359296 bit
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Memory IC Type
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MULTI-PORT SRAM
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Memory Width
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36
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Moisture Sensitivity Level
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3
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Number of Functions
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1
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Number of Ports
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2
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Number of Terminals
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256
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Number of Words
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65536 words
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Number of Words Code
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64000
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Operating Mode
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SYNCHRONOUS
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Operating Temperature-Max
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70 °C
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Operating Temperature-Min
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Organization
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64KX36
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Output Characteristics
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3-STATE
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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LBGA
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Package Equivalence Code
|
BGA256,16X16,40
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Package Shape
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SQUARE
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Package Style
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GRID ARRAY, LOW PROFILE
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Parallel/Serial
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PARALLEL
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Peak Reflow Temperature (Cel)
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225
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Qualification Status
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Not Qualified
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Seated Height-Max
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1.5 mm
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Standby Current-Max
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0.015 A
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Standby Voltage-Min
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2.4 V
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Supply Current-Max
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0.45 mA
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Supply Voltage-Max (Vsup)
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2.6 V
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Supply Voltage-Min (Vsup)
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2.4 V
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Supply Voltage-Nom (Vsup)
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2.5 V
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Surface Mount
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YES
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Technology
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CMOS
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Temperature Grade
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COMMERCIAL
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Terminal Finish
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Tin/Lead (Sn63Pb37)
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Terminal Form
|
BALL
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Terminal Pitch
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1 mm
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Terminal Position
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BOTTOM
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Time@Peak Reflow Temperature-Max (s)
|
20
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Width
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17 mm
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Alternate Parts for IDT70T3589S166BC
This table gives cross-reference parts and alternative options found for IDT70T3589S166BC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IDT70T3589S166BC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 70V3589S166BC | 64K x 36 Sync, 3.3V Dual-Port RAM, Pipelined/Flow-Through, Interleaved I/O''s, CABGA90/Tray | Renesas Electronics Corporation | IDT70T3589S166BC vs 70V3589S166BC |
| 70T3589S166BCI | Dual-Port SRAM, 64KX36, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 | Integrated Device Technology Inc | IDT70T3589S166BC vs 70T3589S166BCI |
| IDT70T3589S166BC8 | Dual-Port SRAM, 64KX36, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 | Integrated Device Technology Inc | IDT70T3589S166BC vs IDT70T3589S166BC8 |
| IDT70T3589S166BCI | Dual-Port SRAM, 64KX36, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 | Integrated Device Technology Inc | IDT70T3589S166BC vs IDT70T3589S166BCI |
| IDT70V3589S166BC | Dual-Port SRAM, 64KX36, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 | Integrated Device Technology Inc | IDT70T3589S166BC vs IDT70V3589S166BC |
| IDT70T3589S166BCG | Dual-Port SRAM, 64KX36, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, GREEN, BGA-256 | Integrated Device Technology Inc | IDT70T3589S166BC vs IDT70T3589S166BCG |
| 70T3589S166BCG | Dual-Port SRAM, 64KX36, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, GREEN, BGA-256 | Integrated Device Technology Inc | IDT70T3589S166BC vs 70T3589S166BCG |
| 70T3589S166BC | CABGA-256, Tray | Integrated Device Technology Inc | IDT70T3589S166BC vs 70T3589S166BC |
| 70T3589S166BC | 64K x 36 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA90/Tray | Renesas Electronics Corporation | IDT70T3589S166BC vs 70T3589S166BC |
| 70V3589S166BCG | 64K x 36 Sync, 3.3V Dual-Port RAM, Pipelined/Flow-Through, Interleaved I/O''s, CABGA90/Tray | Renesas Electronics Corporation | IDT70T3589S166BC vs 70V3589S166BCG |