Datasheets
70T3319S133BFI8 by:

256K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel

Part Details for 70T3319S133BFI8 by Renesas Electronics Corporation

Overview of 70T3319S133BFI8 by Renesas Electronics Corporation

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Applications Consumer Electronics Energy and Power Systems Renewable Energy Automotive

Price & Stock for 70T3319S133BFI8

Part # Distributor Description Stock Price Buy
DISTI # 70T3319S133BFI8
Avnet Americas 256K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O's - Tape and Reel (Alt: 70T3319S133BFI8) RoHS: Not Compliant Min Qty: 1000 Package Multiple: 1000 Container: Reel 0
RFQ
Future Electronics   RoHS: Compliant pbFree: Yes Min Qty: 1000 Package Multiple: 1000 Lead time: 36 Weeks Container: Reel 0
Reel
  • 1,000 $180.9400
$180.9400 Buy Now
Future Electronics   RoHS: Compliant pbFree: Yes Min Qty: 1000 Package Multiple: 1000 Lead time: 36 Weeks Container: Reel 0
Reel
  • 1,000 $183.2900
$183.2900 Buy Now

Part Details for 70T3319S133BFI8

70T3319S133BFI8 CAD Models

70T3319S133BFI8 Part Data Attributes

70T3319S133BFI8 Renesas Electronics Corporation
Buy Now Datasheet
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70T3319S133BFI8 Renesas Electronics Corporation 256K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel
Pbfree Code No
Rohs Code No
Part Life Cycle Code End Of Life
Ihs Manufacturer RENESAS ELECTRONICS CORP
Part Package Code CABGA
Pin Count 208
Manufacturer Package Code BF208
Reach Compliance Code not_compliant
ECCN Code NLR
HTS Code 8542320041
Samacsys Manufacturer Renesas Electronics
Access Time-Max 15 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 133 MHz
I/O Type COMMON
JESD-30 Code S-PBGA-B208
JESD-609 Code e0
Length 15 mm
Memory Density 4718592 bit
Memory IC Type MULTI-PORT SRAM
Memory Width 18
Moisture Sensitivity Level 3
Number of Functions 1
Number of Ports 2
Number of Terminals 208
Number of Words 262144 words
Number of Words Code 256000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 256KX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA208,17X17,32
Package Shape SQUARE
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified
Seated Height-Max 1.2 mm
Standby Current-Max 0.02 A
Standby Voltage-Min 2.4 V
Supply Current-Max 0.45 mA
Supply Voltage-Max (Vsup) 2.6 V
Supply Voltage-Min (Vsup) 2.4 V
Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 15 mm

Alternate Parts for 70T3319S133BFI8

This table gives cross-reference parts and alternative options found for 70T3319S133BFI8. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 70T3319S133BFI8, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
70T3319S133BFI CABGA-208, Tray Integrated Device Technology Inc 70T3319S133BFI8 vs 70T3319S133BFI
70V3319S133BF CABGA-208, Tray Integrated Device Technology Inc 70T3319S133BFI8 vs 70V3319S133BF
IDT70V3319S133BFG8 Dual-Port SRAM, 256KX18, 15ns, CMOS, PBGA208, FBGA-208 Integrated Device Technology Inc 70T3319S133BFI8 vs IDT70V3319S133BFG8
IDT70V3319S133BFI Dual-Port SRAM, 256KX18, 15ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208 Integrated Device Technology Inc 70T3319S133BFI8 vs IDT70V3319S133BFI
IDT70T3319S133BFI Dual-Port SRAM, 256KX18, 15ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208 Integrated Device Technology Inc 70T3319S133BFI8 vs IDT70T3319S133BFI
IDT70T3319S133BFG8 Dual-Port SRAM, 256KX18, 15ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FINE PITCH, BGA-208 Integrated Device Technology Inc 70T3319S133BFI8 vs IDT70T3319S133BFG8
IDT70V3319S133BF8 Dual-Port SRAM, 256KX18, 15ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208 Integrated Device Technology Inc 70T3319S133BFI8 vs IDT70V3319S133BF8
IDT70T3319S133BFGI Dual-Port SRAM, 256KX18, 4.2ns, CMOS, CBGA208, 15 X 15 MM X 1.4 MM, 0.80 MM PITCH, GREEN, FPBGA-208 Integrated Device Technology Inc 70T3319S133BFI8 vs IDT70T3319S133BFGI
IDT70T3319S133BFI8 Dual-Port SRAM, 256KX18, 15ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208 Integrated Device Technology Inc 70T3319S133BFI8 vs IDT70T3319S133BFI8
IDT70V3319S133BFG Dual-Port SRAM, 256KX18, 4.2ns, CMOS, CBGA208, 15 X 15 MM X 1.4 MM, 0.80 MM PITCH, GREEN, FPBGA-208 Integrated Device Technology Inc 70T3319S133BFI8 vs IDT70V3319S133BFG
Part Number Description Manufacturer Compare
IDT70T3319S133BFI Dual-Port SRAM, 256KX18, 15ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208 Integrated Device Technology Inc 70T3319S133BFI8 vs IDT70T3319S133BFI
IDT70T3319S133BCGI Dual-Port SRAM, 256KX18, 4.2ns, CMOS, CBGA256, 17 X 17 MM X 1.4 MM, 1 MM PITCH, GREEN, BGA-256 Integrated Device Technology Inc 70T3319S133BFI8 vs IDT70T3319S133BCGI
IDT70V3319S133BCGI8 Dual-Port SRAM, 256KX18, 15ns, CMOS, PBGA256, BGA-256 Integrated Device Technology Inc 70T3319S133BFI8 vs IDT70V3319S133BCGI8
70T3319S133BCGI Dual-Port SRAM, 256KX18, 4.2ns, CMOS, CBGA256, 17 X 17 MM X 1.4 MM, 1 MM PITCH, GREEN, BGA-256 Integrated Device Technology Inc 70T3319S133BFI8 vs 70T3319S133BCGI
70T3319S133BFI CABGA-208, Tray Integrated Device Technology Inc 70T3319S133BFI8 vs 70T3319S133BFI
70V3319S133PRFGI8 256K x 18 Sync, 3.3V Dual-Port RAM, Pipelined/Flow-Through, Interleaved I/O''s, TQFP0/Reel Renesas Electronics Corporation 70T3319S133BFI8 vs 70V3319S133PRFGI8
IDT70T3319S133BC8 Dual-Port SRAM, 256KX18, 15ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 Integrated Device Technology Inc 70T3319S133BFI8 vs IDT70T3319S133BC8
70V3319S133BC8 256K x 18 Sync, 3.3V Dual-Port RAM, Pipelined/Flow-Through, Interleaved I/O''s, CABGA0/Reel Renesas Electronics Corporation 70T3319S133BFI8 vs 70V3319S133BC8
70V3319S133BC8 CABGA-256, Reel Integrated Device Technology Inc 70T3319S133BFI8 vs 70V3319S133BC8
IDT70V3319S133BCG8 Dual-Port SRAM, 256KX18, 15ns, CMOS, PBGA256, BGA-256 Integrated Device Technology Inc 70T3319S133BFI8 vs IDT70V3319S133BCG8

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