There are no models available for this part yet.
Overview of 70V3319S133BC8 by Integrated Device Technology Inc
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
CAD Models for 70V3319S133BC8 by Integrated Device Technology Inc
Part Data Attributes for 70V3319S133BC8 by Integrated Device Technology Inc
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|
|
|---|---|
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Pbfree Code
|
No
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Rohs Code
|
No
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Part Life Cycle Code
|
Transferred
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Ihs Manufacturer
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INTEGRATED DEVICE TECHNOLOGY INC
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Part Package Code
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CABGA
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Package Description
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17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256
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Pin Count
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256
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Manufacturer Package Code
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BC256
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Reach Compliance Code
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not_compliant
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ECCN Code
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3A991.B.2.A
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HTS Code
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8542.32.00.41
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Access Time-Max
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15 ns
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Additional Feature
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PIPELINED OR FLOW-THROUGH ARCHITECTURE
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Clock Frequency-Max (fCLK)
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133 MHz
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I/O Type
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COMMON
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JESD-30 Code
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S-PBGA-B256
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JESD-609 Code
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e0
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Length
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17 mm
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Memory Density
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4718592 bit
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Memory IC Type
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MULTI-PORT SRAM
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Memory Width
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18
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Moisture Sensitivity Level
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3
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Number of Functions
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1
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Number of Ports
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2
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Number of Terminals
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256
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Number of Words
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262144 words
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Number of Words Code
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256000
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Operating Mode
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SYNCHRONOUS
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Operating Temperature-Max
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70 °C
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Operating Temperature-Min
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Organization
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256KX18
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Output Characteristics
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3-STATE
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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LBGA
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Package Equivalence Code
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BGA256,16X16,40
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Package Shape
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SQUARE
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Package Style
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GRID ARRAY, LOW PROFILE
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Parallel/Serial
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PARALLEL
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Peak Reflow Temperature (Cel)
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225
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Qualification Status
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Not Qualified
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Seated Height-Max
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1.7 mm
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Standby Current-Max
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0.03 A
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Standby Voltage-Min
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3.15 V
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Supply Current-Max
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0.4 mA
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Supply Voltage-Max (Vsup)
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3.45 V
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Supply Voltage-Min (Vsup)
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3.15 V
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Supply Voltage-Nom (Vsup)
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3.3 V
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Surface Mount
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YES
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Technology
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CMOS
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Temperature Grade
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COMMERCIAL
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Terminal Finish
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TIN LEAD
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Terminal Form
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BALL
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Terminal Pitch
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1 mm
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Terminal Position
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BOTTOM
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Time@Peak Reflow Temperature-Max (s)
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20
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Width
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17 mm
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Alternate Parts for 70V3319S133BC8
This table gives cross-reference parts and alternative options found for 70V3319S133BC8. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 70V3319S133BC8, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| IDT70V3319S133BCGI | Dual-Port SRAM, 256KX18, 4.2ns, CMOS, CBGA256, 17 X 17 MM X 1.4 MM, 1 MM PITCH, GREEN, BGA-256 | Integrated Device Technology Inc | 70V3319S133BC8 vs IDT70V3319S133BCGI |
| IDT70T3319S133BCGI | Dual-Port SRAM, 256KX18, 4.2ns, CMOS, CBGA256, 17 X 17 MM X 1.4 MM, 1 MM PITCH, GREEN, BGA-256 | Integrated Device Technology Inc | 70V3319S133BC8 vs IDT70T3319S133BCGI |
| IDT70V3319S133BC8 | Dual-Port SRAM, 256KX18, 15ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 | Integrated Device Technology Inc | 70V3319S133BC8 vs IDT70V3319S133BC8 |
| IDT70T3319S133BCGI8 | Dual-Port SRAM, 256KX18, 15ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 | Integrated Device Technology Inc | 70V3319S133BC8 vs IDT70T3319S133BCGI8 |
| IDT70T3319S133BCG | Dual-Port SRAM, 256KX18, 4.2ns, CMOS, CBGA256, 17 X 17 MM X 1.4 MM, 1 MM PITCH, GREEN, BGA-256 | Integrated Device Technology Inc | 70V3319S133BC8 vs IDT70T3319S133BCG |
| 70T3319S133BCI | CABGA-256, Tray | Integrated Device Technology Inc | 70V3319S133BC8 vs 70T3319S133BCI |
| IDT70V3319S133BCG | Dual-Port SRAM, 256KX18, 4.2ns, CMOS, CBGA256, 17 X 17 MM X 1.4 MM, 1 MM PITCH, GREEN, BGA-256 | Integrated Device Technology Inc | 70V3319S133BC8 vs IDT70V3319S133BCG |
| 70T3319S133BCG | Dual-Port SRAM, 256KX18, 4.2ns, CMOS, CBGA256, 17 X 17 MM X 1.4 MM, 1 MM PITCH, GREEN, BGA-256 | Integrated Device Technology Inc | 70V3319S133BC8 vs 70T3319S133BCG |
| 70T3319S133BCG8 | Dual-Port SRAM, 256KX18, 15ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 | Integrated Device Technology Inc | 70V3319S133BC8 vs 70T3319S133BCG8 |
| 70V3319S133BCI | CABGA-256, Tray | Integrated Device Technology Inc | 70V3319S133BC8 vs 70V3319S133BCI |