Part Details for 5962-9679602HXC by Microsemi Corporation
Overview of 5962-9679602HXC by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 5962-8672601EA | Rochester Electronics LLC | Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.875 INCH, DIP-16 | |
| 5962-8672601FA | Rochester Electronics LLC | Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.375 INCH, FP-16 | |
| 5962-87518013A | Rochester Electronics LLC | Interrupt Controller, NMOS, CQCC28, CERAMIC, LCC-28 |
Part Details for 5962-9679602HXC
5962-9679602HXC CAD Models
5962-9679602HXC Part Data Attributes
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5962-9679602HXC
Microsemi Corporation
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5962-9679602HXC
Microsemi Corporation
EEPROM, 128KX8, 250ns, Parallel, CMOS, CDSO32, CERAMIC, DSO 32
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Part Package Code | SOIC | |
| Package Description | SOJ, | |
| Pin Count | 32 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 250 ns | |
| JESD-30 Code | R-CDSO-J32 | |
| JESD-609 Code | e4 | |
| Memory Density | 1048576 bit | |
| Memory IC Type | EEPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 128KX8 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | SOJ | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 5 V | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-STD-883 | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | GOLD | |
| Terminal Form | J BEND | |
| Terminal Position | DUAL | |
| Width | 11.23 mm | |
| Write Cycle Time-Max (tWC) | 10 ms |
Alternate Parts for 5962-9679602HXC
This table gives cross-reference parts and alternative options found for 5962-9679602HXC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-9679602HXC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| WME128K8-250DEQE | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDSO32, 0.400 INCH, HERMETIC SEALED, CERAMIC, SOJ-32 | Microsemi Corporation | 5962-9679602HXC vs WME128K8-250DEQE |
| WME128K8-250DEIE | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDSO32, 0.400 INCH, HERMETIC SEALED, CERAMIC, SOJ-32 | Mercury Systems Inc | 5962-9679602HXC vs WME128K8-250DEIE |
| WME128K8-250DEQEA | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDSO32, 0.400 INCH, HERMETIC SEALED, CERAMIC, SOJ-32 | Microsemi Corporation | 5962-9679602HXC vs WME128K8-250DEQEA |
| WME128K8-250DEIA | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDSO32, 0.400 INCH, HERMETIC SEALED, CERAMIC, SOJ-32 | Mercury Systems Inc | 5962-9679602HXC vs WME128K8-250DEIA |
| WME128K8-250DEM | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDSO32, 0.400 INCH, HERMETIC SEALED, CERAMIC, SOJ-32 | Microsemi Corporation | 5962-9679602HXC vs WME128K8-250DEM |
| WME128K8X-250DEI | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDSO32, CERAMIC, SOJ-32 | Microsemi Corporation | 5962-9679602HXC vs WME128K8X-250DEI |
| WME128K8X-250DEQ | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDSO32, CERAMIC, SOJ-32 | Microsemi Corporation | 5962-9679602HXC vs WME128K8X-250DEQ |
| WME128K8-250DEME | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDSO32, 0.400 INCH, HERMETIC SEALED, CERAMIC, SOJ-32 | Microsemi Corporation | 5962-9679602HXC vs WME128K8-250DEME |
| WME128K8-250DECA | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDSO32, 0.400 INCH, HERMETIC SEALED, CERAMIC, SOJ-32 | Microsemi Corporation | 5962-9679602HXC vs WME128K8-250DECA |
| WME128K8-250DECEA | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDSO32, 0.400 INCH, HERMETIC SEALED, CERAMIC, SOJ-32 | Microsemi Corporation | 5962-9679602HXC vs WME128K8-250DECEA |