5962-9561312HYC
Description: Standard SRAM, 512KX8, 35ns, CMOS, CDIP32, CERAMIC, DIP-32

Overview of 5962-9561312HYC by Mercury Systems Inc

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Energy and Power Systems Transportation and Logistics Renewable Energy Automotive

Available Datasheets

Part # Manufacturer Description Datasheet
5962-8672601EA Rochester Electronics LLC Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.875 INCH, DIP-16
5962-8672601FA Rochester Electronics LLC Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.375 INCH, FP-16
5962-87518013A Rochester Electronics LLC Interrupt Controller, NMOS, CQCC28, CERAMIC, LCC-28

CAD Models for 5962-9561312HYC by Mercury Systems Inc
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Part Data Attributes for 5962-9561312HYC by Mercury Systems Inc

5962-9561312HYC
Mercury Systems Inc
-
-
Part Life Cycle Code
Active
Ihs Manufacturer
MERCURY SYSTEMS INC
Package Description
DIP,
Reach Compliance Code
compliant
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.41
Access Time-Max
35 ns
JESD-30 Code
R-CDIP-T32
JESD-609 Code
e4
Length
41.525 mm
Memory Density
4194304 bit
Memory IC Type
STANDARD SRAM
Memory Width
8
Number of Functions
1
Number of Terminals
32
Number of Words
524288 words
Number of Words Code
512000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
512KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Qualification Status
Qualified
Screening Level
MIL-PRF-38534 Class H
Seated Height-Max
5.13 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
MILITARY
Terminal Finish
GOLD
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Width
15.24 mm
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  1. 5962-9561312HYC
    Mercury Systems Inc
    Standard SRAM, 512KX8, 35ns, CMOS, CDIP32, CERAMIC, DIP-32
    VS

Alternate Parts for 5962-9561312HYC

This table gives cross-reference parts and alternative options found for 5962-9561312HYC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-9561312HYC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
AS5C4008CW-35E/883C Standard SRAM, 512KX8, 35ns, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32 Micross Components 5962-9561312HYC vs AS5C4008CW-35E/883C
WS512K8-35CQ SRAM Module, 512KX8, 35ns, CMOS, CDMA32, 0.600 INCH, CERAMIC, DIP-32 Mercury Systems Inc 5962-9561312HYC vs WS512K8-35CQ
5962-9561307HYA Standard SRAM, 512KX8, 35ns, CMOS, CDIP32, CERAMIC, DIP-32 Mercury Systems Inc 5962-9561312HYC vs 5962-9561307HYA
5962-9207807HXC SRAM Module, 512KX8, 35ns, CMOS, DIP-32 Mercury Systems Inc 5962-9561312HYC vs 5962-9207807HXC
5962-9561312HYA Standard SRAM, 512KX8, 35ns, CMOS, CDIP32, CERAMIC, DIP-32 White Microelectronics 5962-9561312HYC vs 5962-9561312HYA
5962-9207807HTX SRAM Module, 512KX8, 35ns, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32 Mercury Systems Inc 5962-9561312HYC vs 5962-9207807HTX
MS8512SCLMB-35 SRAM Module, 512KX8, 35ns, CMOS Mosaic Semiconductor Inc 5962-9561312HYC vs MS8512SCLMB-35
DPS512S8AP-35I SRAM Module, 512KX8, 35ns, CMOS, CDMA32, CERDIP-32 Twilight Technology Inc 5962-9561312HYC vs DPS512S8AP-35I
WMS512K8-35CIA Standard SRAM, 512KX8, 35ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Mercury Systems Inc 5962-9561312HYC vs WMS512K8-35CIA
DPS512S8BN-35B SRAM Module, 512KX8, 35ns, CMOS, CDMA32, SIDE BRAZED, CERAMIC PACKAGE-32 Twilight Technology Inc 5962-9561312HYC vs DPS512S8BN-35B
Part Number Description Manufacturer Compare
5962-8685909LA CDIP-24, Tube Integrated Device Technology Inc 5962-9561312HYC vs 5962-8685909LA
AS8S512K32P-20L/IT SRAM Module, 512KX32, 20ns, CMOS, CPGA66, PGA-66 Micross Components 5962-9561312HYC vs AS8S512K32P-20L/IT
5962-8855202XX Standard SRAM, 32KX8, 70ns, CMOS, CDIP28, Electronic Designs Inc 5962-9561312HYC vs 5962-8855202XX
P4C1982-20FMB Standard SRAM, 16KX4, 20ns, CMOS, CDFP28, CERPACK-28 Pyramid Semiconductor Corporation 5962-9561312HYC vs P4C1982-20FMB
5962-9318714HTA Cache SRAM Module, 128KX32, 35ns, CMOS, HIP-66 Cobham Power Products 5962-9561312HYC vs 5962-9318714HTA
P4C116-35LM Standard SRAM, 2KX8, 35ns, CMOS, 0.300 X 0.400 INCH, LCC-24 Pyramid Semiconductor Corporation 5962-9561312HYC vs P4C116-35LM
5962-9461110HMC Cache SRAM Module, 512KX32, 17ns, CMOS, CQFP68, CO-FIRED CERAMIC, QFP-68 White Microelectronics 5962-9561312HYC vs 5962-9461110HMC
P4C198-35PC Standard SRAM, 16KX4, 35ns, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 Pyramid Semiconductor Corporation 5962-9561312HYC vs P4C198-35PC
P4C1256-45PILF Standard SRAM, 32KX8, 45ns, CMOS, PDIP28, 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-28 Pyramid Semiconductor Corporation 5962-9561312HYC vs P4C1256-45PILF
5962-8855208ZA Standard SRAM, 32KX8, 55ns, CMOS, CDFP28, CERAMIC, FP-28 Integrated Device Technology Inc 5962-9561312HYC vs 5962-8855208ZA

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