Part Details for 5962-9080306MLA by Teledyne e2v
Overview of 5962-9080306MLA by Teledyne e2v
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Space Technology
Aerospace and Defense
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
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5962-8672601EA | Rochester Electronics LLC | Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.875 INCH, DIP-16 | |
5962-8672601FA | Rochester Electronics LLC | Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.375 INCH, FP-16 | |
5962-87518013A | Rochester Electronics LLC | Interrupt Controller, NMOS, CQCC28, CERAMIC, LCC-28 |
Price & Stock for 5962-9080306MLA
Part # | Distributor | Description | Stock | Price | Buy | |
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Teledyne e2v | PROM, 8K X 8, 45 NS ACCESS TIME Lead time: 14 Weeks, 0 Days | 0 |
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RFQ |
Part Details for 5962-9080306MLA
5962-9080306MLA CAD Models
5962-9080306MLA Part Data Attributes
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5962-9080306MLA
Teledyne e2v
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5962-9080306MLA
Teledyne e2v
OTP ROM, 8KX8, 45ns, CMOS, CDIP24,
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Part Life Cycle Code | Active | |
Ihs Manufacturer | TELEDYNE E2V (UK) LTD | |
Package Description | DIP, DIP24,.3 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Access Time-Max | 45 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-GDIP-T24 | |
JESD-609 Code | e0 | |
Length | 31.877 mm | |
Memory Density | 65536 bit | |
Memory IC Type | OTP ROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 24 | |
Number of Words | 8192 words | |
Number of Words Code | 8000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Organization | 8KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | DIP | |
Package Equivalence Code | DIP24,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Qualified | |
Screening Level | 38535Q/M;38534H;883B | |
Seated Height-Max | 5.08 mm | |
Standby Current-Max | 0.03 A | |
Supply Current-Max | 0.12 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 7.62 mm |
Alternate Parts for 5962-9080306MLA
This table gives cross-reference parts and alternative options found for 5962-9080306MLA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-9080306MLA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
CY7C263-45PC | OTP ROM, 8KX8, 45ns, CMOS, PDIP24, 0.300 INCH, SLIM, PLASTIC, DIP-24 | Cypress Semiconductor | 5962-9080306MLA vs CY7C263-45PC |
TMS27PC49-4NTL | 8KX8 OTPROM, 45ns, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | Texas Instruments | 5962-9080306MLA vs TMS27PC49-4NTL |
AT27HC642R-45PI | OTP ROM, 8KX8, 45ns, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | Atmel Corporation | 5962-9080306MLA vs AT27HC642R-45PI |
93Z565ADC | OTP ROM, 8KX8, 45ns, TTL, CDIP24, CERAMIC, DIP-24 | Fairchild Semiconductor Corporation | 5962-9080306MLA vs 93Z565ADC |
8200903JA | OTP ROM, 8KX8, 45ns, Bipolar, CDIP24 | QP Semiconductor | 5962-9080306MLA vs 8200903JA |
N82HS641AF | OTP ROM, 8KX8, 45ns, Bipolar, CDIP24 | YAGEO Corporation | 5962-9080306MLA vs N82HS641AF |
8200903JA | IC 8K X 8 OTPROM, 45 ns, CDIP24, CERAMIC, DIP-24, Programmable ROM | NXP Semiconductors | 5962-9080306MLA vs 8200903JA |
27HC641L-45I/P | 8K X 8 OTPROM, 45 ns, PDIP24, PLASTIC, DIP-24 | Microchip Technology Inc | 5962-9080306MLA vs 27HC641L-45I/P |
27HC641-45I/P | 8K X 8 OTPROM, 45 ns, PDIP24, PLASTIC, DIP-24 | Microchip Technology Inc | 5962-9080306MLA vs 27HC641-45I/P |
8200903JX | OTP ROM, 8KX8, 45ns, Bipolar, CDIP24 | QP Semiconductor | 5962-9080306MLA vs 8200903JX |