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Memory OTP ROMs 5962-8863604LA

Memory
5962-8863604LA
Description: OTP ROM, 1KX8, 45ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24

Overview of 5962-8863604LA by Teledyne e2v

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Aerospace and Defense

Available Datasheets

Part # Manufacturer Description Datasheet
5962-8672601EA Rochester Electronics LLC Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.875 INCH, DIP-16
5962-8672601FA Rochester Electronics LLC Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.375 INCH, FP-16
5962-87518013A Rochester Electronics LLC Interrupt Controller, NMOS, CQCC28, CERAMIC, LCC-28

Price & Stock for 5962-8863604LA by Teledyne e2v

Part # Manufacturer Description Stock Price Buy
Teledyne e2v PROM, 1K X 8, REGISTERED, 30 NS Lead time: 14 Weeks, 0 Days 0
RFQ

CAD Models for 5962-8863604LA by Teledyne e2v
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Part Data Attributes for 5962-8863604LA by Teledyne e2v
Parametric Data

5962-8863604LA
Teledyne e2v
Buy Now
-
-
Rohs Code
No
Part Life Cycle Code
Active
Ihs Manufacturer
TELEDYNE E2V (UK) LTD
Part Package Code
DIP
Package Description
0.300 INCH, CERDIP-24
Pin Count
24
Reach Compliance Code
not_compliant
ECCN Code
EAR99
HTS Code
8542.32.00.71
Access Time-Max
45 ns
I/O Type
COMMON
JESD-30 Code
R-GDIP-T24
JESD-609 Code
e0
Length
31.877 mm
Memory Density
8192 bit
Memory IC Type
OTP ROM
Memory Width
8
Number of Functions
1
Number of Terminals
24
Number of Words
1024 words
Number of Words Code
1000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
1KX8
Output Characteristics
REGISTERED
Package Body Material
CERAMIC, GLASS-SEALED
Package Code
DIP
Package Equivalence Code
DIP24,.3
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Programming Voltage
12.5 V
Qualification Status
Qualified
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
5.08 mm
Standby Current-Max
0.12 A
Supply Current-Max
0.12 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Width
7.62 mm
Want to compare parts?
  1. 5962-8863604LA
    Teledyne e2v
    OTP ROM, 1KX8, 45ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24
    VS

Alternate Parts for 5962-8863604LA

This table gives cross-reference parts and alternative options found for 5962-8863604LA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-8863604LA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
CY7C235-30DMB OTP ROM, 1KX8, 45ns, CMOS, CDIP24, 0.300 INCH, SLIM, CERDIP-24 Cypress Semiconductor 5962-8863604LA vs CY7C235-30DMB
5962-8863602LA OTP ROM, 1KX8, 45ns, CMOS, CDIP24, Teledyne e2v 5962-8863604LA vs 5962-8863602LA
CY7C235A-25DMB OTP ROM, 1KX8, 12ns, CMOS, CDIP24, 0.300 INCH, SLIM, HERMETIC SEALED, CERDIP-24 Cypress Semiconductor 5962-8863604LA vs CY7C235A-25DMB
CY7C235A-30DMB OTP ROM, 1KX8, 15ns, CMOS, CDIP24, 0.300 INCH, SLIM, HERMETIC SEALED, CERDIP-24 Cypress Semiconductor 5962-8863604LA vs CY7C235A-30DMB
5962-8863601LX OTP ROM, 1KX8, CMOS, CDIP24, Teledyne e2v 5962-8863604LA vs 5962-8863601LX
5962-8863604LA OTP ROM, 1KX8, 45ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24 Cypress Semiconductor 5962-8863604LA vs 5962-8863604LA
CY7C235-30DI OTP ROM, 1KX8, CMOS, CDIP24, 0.300 INCH, SLIM, HERMETIC SEALED, CERDIP-24 Cypress Semiconductor 5962-8863604LA vs CY7C235-30DI
5962-8863602LX OTP ROM, 1KX8, CMOS, CDIP24, Cypress Semiconductor 5962-8863604LA vs 5962-8863602LX
Part Number Description Manufacturer Compare
M38510/20909BKX OTP ROM, 1KX8, 55ns, Bipolar, 0.375 X 0.625 INCH, FP-24 Teledyne e2v 5962-8863604LA vs M38510/20909BKX
5962-8765103JX OTP ROM, 1KX8, 30ns, CMOS, CDIP24, CERAMIC, DIP-24 Cypress Semiconductor 5962-8863604LA vs 5962-8765103JX
5962-8863602KA OTP ROM, 1KX8, CMOS, CDFP24, CERPACK-24 Cypress Semiconductor 5962-8863604LA vs 5962-8863602KA
5962-8863604LB OTP ROM, 1KX8, CMOS, CDIP24, 0.300 INCH, CERDIP-24 Cypress Semiconductor 5962-8863604LA vs 5962-8863604LB
63S881NS OTP ROM, 1KX8, 45ns, Bipolar, PDIP24, SKINNY, PLASTIC, DIP-24 AMD 5962-8863604LA vs 63S881NS
5962-8765102LB OTP ROM, 1KX8, 45ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24 Cypress Semiconductor 5962-8863604LA vs 5962-8765102LB
5962-8765103LA OTP ROM, 1KX8, 30ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24 Cypress Semiconductor 5962-8863604LA vs 5962-8765103LA
M38510/20909BJA OTP ROM, 1KX8, 55ns, Bipolar, 0.5 X 0.75 INCH, DIP-24 Teledyne e2v 5962-8863604LA vs M38510/20909BJA
5962-8670602LX IC 1K X 8 OTPROM, CDIP24, 1.280 X 0.310 X 0.200 INCH, DIP-24, Programmable ROM NXP Semiconductors 5962-8863604LA vs 5962-8670602LX
82S181/BJA OTP ROM, 1KX8, 90ns, Bipolar, CDIP24, YAGEO Corporation 5962-8863604LA vs 82S181/BJA

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