5962-8863604LA
vs
5962-8863604LA
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
TELEDYNE E2V (UK) LTD
CYPRESS SEMICONDUCTOR CORP
Part Package Code
DIP
DIP
Package Description
0.300 INCH, CERDIP-24
0.300 INCH, CERDIP-24
Pin Count
24
24
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
45 ns
45 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-GDIP-T24
R-GDIP-T24
JESD-609 Code
e0
e0
Length
31.877 mm
31.877 mm
Memory Density
8192 bit
8192 bit
Memory IC Type
OTP ROM
OTP ROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
24
24
Number of Words
1024 words
1024 words
Number of Words Code
1000
1000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
1KX8
1KX8
Output Characteristics
REGISTERED
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP24,.3
DIP24,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
12.5 V
12.5 V
Qualification Status
Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
38535Q/M;38534H;883B
Seated Height-Max
5.08 mm
5.08 mm
Standby Current-Max
0.12 A
0.12 A
Supply Current-Max
0.12 mA
0.12 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
1
1
Pbfree Code
Compare 5962-8863604LA with alternatives
Compare 5962-8863604LA with alternatives