5962-8863601LA
Description: OTP ROM, 1KX8, 60ns, CMOS, CDIP24,

Overview of 5962-8863601LA by Teledyne e2v

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Education and Research Internet of Things (IoT) Computing and Data Storage Aerospace and Defense Healthcare Telecommunications Automotive

Available Datasheets

Part # Manufacturer Description Datasheet
5962-8672601EA Rochester Electronics LLC Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.875 INCH, DIP-16
5962-8672601FA Rochester Electronics LLC Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.375 INCH, FP-16
5962-87518013A Rochester Electronics LLC Interrupt Controller, NMOS, CQCC28, CERAMIC, LCC-28

Price & Stock for 5962-8863601LA by Teledyne e2v

Part # Manufacturer Description Stock Price Buy
Teledyne e2v PROM, 1K X 8, REGISTERED, 40 NS ACCESS TIME Lead time: 14 Weeks, 0 Days 0
RFQ

CAD Models for 5962-8863601LA by Teledyne e2v
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Part Data Attributes for 5962-8863601LA by Teledyne e2v

5962-8863601LA
Teledyne e2v
-
-
Part Life Cycle Code
Active
Ihs Manufacturer
TELEDYNE E2V (UK) LTD
Package Description
DIP, DIP24,.3
Reach Compliance Code
compliant
ECCN Code
EAR99
HTS Code
8542.32.00.71
Access Time-Max
60 ns
I/O Type
COMMON
JESD-30 Code
R-GDIP-T24
JESD-609 Code
e0
Length
31.877 mm
Memory Density
8192 bit
Memory IC Type
OTP ROM
Memory Width
8
Number of Functions
1
Number of Terminals
24
Number of Words
1024 words
Number of Words Code
1000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
1KX8
Output Characteristics
REGISTERED
Package Body Material
CERAMIC, GLASS-SEALED
Package Code
DIP
Package Equivalence Code
DIP24,.3
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Programming Voltage
13.5 V
Qualification Status
Qualified
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
5.08 mm
Standby Current-Max
0.12 A
Supply Current-Max
0.12 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Width
7.62 mm
Want to compare parts?
  1. 5962-8863601LA
    Teledyne e2v
    OTP ROM, 1KX8, 60ns, CMOS, CDIP24,
    VS

Alternate Parts for 5962-8863601LA

This table gives cross-reference parts and alternative options found for 5962-8863601LA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-8863601LA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
CY7C235-40PC OTP ROM, 1KX8, 60ns, CMOS, PDIP24, 0.300 INCH, SLIM, PLASTIC, DIP-24 Cypress Semiconductor 5962-8863601LA vs CY7C235-40PC
CY7C235-25DC OTP ROM, 1KX8, 37ns, CMOS, CDIP24, 0.300 INCH, SLIM, CERDIP-24 Cypress Semiconductor 5962-8863601LA vs CY7C235-25DC
5962-8863602LA OTP ROM, 1KX8, CMOS, CDIP24, 0.300 INCH, CERDIP-24 Cypress Semiconductor 5962-8863601LA vs 5962-8863602LA
CY7C235A-30DMB OTP ROM, 1KX8, 15ns, CMOS, CDIP24, 0.300 INCH, SLIM, HERMETIC SEALED, CERDIP-24 Cypress Semiconductor 5962-8863601LA vs CY7C235A-30DMB
5962-8863604LC OTP ROM, 1KX8, CMOS, CDIP24, 0.300 INCH, CERDIP-24 Cypress Semiconductor 5962-8863601LA vs 5962-8863604LC
CY7C235-30DMB OTP ROM, 1KX8, 45ns, CMOS, CDIP24, 0.300 INCH, SLIM, CERDIP-24 Cypress Semiconductor 5962-8863601LA vs CY7C235-30DMB
CY7C235A-25DMB OTP ROM, 1KX8, 12ns, CMOS, CDIP24, 0.300 INCH, SLIM, HERMETIC SEALED, CERDIP-24 Cypress Semiconductor 5962-8863601LA vs CY7C235A-25DMB
CY7C235-40DI OTP ROM, 1KX8, CMOS, CDIP24, 0.300 INCH, SLIM, HERMETIC SEALED, CERDIP-24 Cypress Semiconductor 5962-8863601LA vs CY7C235-40DI
5962-8863604LA OTP ROM, 1KX8, 45ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24 Cypress Semiconductor 5962-8863601LA vs 5962-8863604LA
5962-8863601LA OTP ROM, 1KX8, CMOS, CDIP24, 0.300 INCH, CERDIP-24 Cypress Semiconductor 5962-8863601LA vs 5962-8863601LA
Part Number Description Manufacturer Compare
S82S280I 1KX8 OTPROM, CDIP24 Philips Semiconductors 5962-8863601LA vs S82S280I
CY7C235A-18PC OTP ROM, 1KX8, 12ns, CMOS, PDIP24, 0.300 INCH, SLIM, PLASTIC, DIP-24 Cypress Semiconductor 5962-8863601LA vs CY7C235A-18PC
6380-2JS OTP ROM, 1KX8, 70ns, CMOS, CDIP24, Monolithic Memories (RETIRED) 5962-8863601LA vs 6380-2JS
TBP28L86NP3 OTP ROM Rochester Electronics LLC 5962-8863601LA vs TBP28L86NP3
53S881N OTP ROM, 1KX8, 55ns, Bipolar, PDIP24, SKINNY, PLASTIC, DIP-24 AMD 5962-8863601LA vs 53S881N
DM87S181AJ 1KX8 OTPROM, 45ns, CDIP24, CERAMIC, DIP-24 Texas Instruments 5962-8863601LA vs DM87S181AJ
DM77S280J IC 1K X 8 OTPROM, 75 ns, CDIP24, CERAMIC, DIP-24, Programmable ROM National Semiconductor Corporation 5962-8863601LA vs DM77S280J
63RS881JS OTP ROM, 1KX8, 30ns, CMOS, CDIP24, Monolithic Memories (RETIRED) 5962-8863601LA vs 63RS881JS
AM27S181ADCB OTP ROM, 1KX8, 35ns, Bipolar, CDIP24, 0.600 INCH, CERAMIC, DIP-24 AMD 5962-8863601LA vs AM27S181ADCB
DM87S181N IC 1K X 8 OTPROM, 55 ns, PDIP24, PLASTIC, DIP-24, Programmable ROM Texas Instruments 5962-8863601LA vs DM87S181N

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