Datasheets
5962-8852510XX by:

EEPROM, 32KX8, 300ns, Parallel, CMOS, CDIP28, CERAMIC, DIP-28

Part Details for 5962-8852510XX by Atmel Corporation

Overview of 5962-8852510XX by Atmel Corporation

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Applications Security and Surveillance Audio and Video Systems Transportation and Logistics Renewable Energy Automotive Robotics and Drones

Available Datasheets

Part # Manufacturer Description Datasheet
5962-8672601EA Rochester Electronics LLC Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.875 INCH, DIP-16
5962-8672601FA Rochester Electronics LLC Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.375 INCH, FP-16
5962-87518013A Rochester Electronics LLC Interrupt Controller, NMOS, CQCC28, CERAMIC, LCC-28

Part Details for 5962-8852510XX

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5962-8852510XX Part Data Attributes

5962-8852510XX Atmel Corporation
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5962-8852510XX Atmel Corporation EEPROM, 32KX8, 300ns, Parallel, CMOS, CDIP28, CERAMIC, DIP-28
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer ATMEL CORP
Part Package Code DIP
Package Description DIP,
Pin Count 28
Reach Compliance Code compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.51
Access Time-Max 300 ns
Additional Feature AUTOMATIC WRITE
JESD-30 Code R-GDIP-T28
JESD-609 Code e0
Length 37.215 mm
Memory Density 262144 bit
Memory IC Type EEPROM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 32768 words
Number of Words Code 32000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 32KX8
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Programming Voltage 5 V
Qualification Status Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 5.72 mm
Supply Current-Max 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm
Write Cycle Time-Max (tWC) 10 ms

Alternate Parts for 5962-8852510XX

This table gives cross-reference parts and alternative options found for 5962-8852510XX. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-8852510XX, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
X28256PI EEPROM, 32KX8, 300ns, Parallel, NMOS, PDIP28, PLASTIC, DIP-28 Xicor Inc 5962-8852510XX vs X28256PI
5962-8852502XA EEPROM, 32KX8, 300ns, Parallel, CMOS, CDIP28, 0.600 INCH, CERDIP-28 Teledyne e2v 5962-8852510XX vs 5962-8852502XA
PQ28C256-300 EEPROM, 32KX8, 300ns, Parallel, CMOS, PDIP28 LSI Corporation 5962-8852510XX vs PQ28C256-300
X28C256PM EEPROM, 32KX8, 300ns, Parallel, CMOS, PDIP28, PLASTIC, DIP-28 Xicor Inc 5962-8852510XX vs X28C256PM
X28256DI EEPROM, 32KX8, 300ns, Parallel, NMOS, CDIP28, HERMETIC SEALED, CERDIP-28 Xicor Inc 5962-8852510XX vs X28256DI
X28C256PI EEPROM, 32KX8, 300ns, Parallel, CMOS, PDIP28, PLASTIC, DIP-28 Xicor Inc 5962-8852510XX vs X28C256PI
CAT28C256PI-30 EEPROM, 32KX8, 300ns, Parallel, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Catalyst Semiconductor 5962-8852510XX vs CAT28C256PI-30
5962-8852502XC EEPROM, 32KX8, 300ns, Parallel, CMOS, CDIP28, CERAMIC, DIP-28 Teledyne e2v 5962-8852510XX vs 5962-8852502XC
CAT28C256P-30 32KX8 EEPROM 5V, 300ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28 onsemi 5962-8852510XX vs CAT28C256P-30
5962-8852510XA EEPROM, 32KX8, 300ns, Parallel, CMOS, CDIP28 LSI Corporation 5962-8852510XX vs 5962-8852510XA
Part Number Description Manufacturer Compare
X28C256PMB EEPROM, 32KX8, 300ns, Parallel, CMOS, PDIP28, PLASTIC, DIP-28 Xicor Inc 5962-8852510XX vs X28C256PMB
X28256P EEPROM, 32KX8, 300ns, Parallel, NMOS, PDIP28, PLASTIC, DIP-28 Xicor Inc 5962-8852510XX vs X28256P
CM28C256-300 EEPROM, 32KX8, 300ns, Parallel, CMOS, CDIP28 LSI Corporation 5962-8852510XX vs CM28C256-300
X28256D EEPROM, 32KX8, 300ns, Parallel, NMOS, CDIP28, HERMETIC SEALED, CERDIP-28 Xicor Inc 5962-8852510XX vs X28256D
5962-8852502XX EEPROM, 32KX8, 300ns, Parallel, CMOS, CDIP28, CERAMIC, DIP-28 Teledyne e2v 5962-8852510XX vs 5962-8852502XX
5962-8852502XA EEPROM, 32KX8, 300ns, Parallel, CMOS, CDIP28, 0.600 INCH, CERDIP-28 LSI Corporation 5962-8852510XX vs 5962-8852502XA
DM28C256-300 EEPROM, 32KX8, 300ns, Parallel, CMOS, CDIP28 LSI Corporation 5962-8852510XX vs DM28C256-300
X28C256PM EEPROM, 32KX8, 300ns, Parallel, CMOS, PDIP28, PLASTIC, DIP-28 Xicor Inc 5962-8852510XX vs X28C256PM
X28C256DMB EEPROM, 32KX8, 300ns, Parallel, CMOS, CDIP28, HERMETIC SEALED, CERDIP-28 Xicor Inc 5962-8852510XX vs X28C256DMB
5962-8852502XA EEPROM, 32KX8, 300ns, Parallel, CMOS, CDIP28, 0.600 INCH, CERDIP-28 Teledyne e2v 5962-8852510XX vs 5962-8852502XA

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