Memory
5962-8765003JX
Description: UVPROM, 2KX8, 35ns, CMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24

Overview of 5962-8765003JX by QP Semiconductor

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Education and Research Internet of Things (IoT) Industrial Automation Computing and Data Storage Aerospace and Defense Healthcare Telecommunications Electronic Manufacturing Automotive

Available Datasheets

Part # Manufacturer Description Datasheet
5962-8672601EA Rochester Electronics LLC Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.875 INCH, DIP-16
5962-8672601FA Rochester Electronics LLC Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.375 INCH, FP-16
5962-87518013A Rochester Electronics LLC Interrupt Controller, NMOS, CQCC28, CERAMIC, LCC-28

CAD Models for 5962-8765003JX by QP Semiconductor
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Part Data Attributes for 5962-8765003JX by QP Semiconductor

5962-8765003JX
QP Semiconductor
-
-
Part Life Cycle Code
Obsolete
Ihs Manufacturer
QP SEMICONDUCTOR INC
Part Package Code
DIP
Package Description
DIP,
Pin Count
24
Reach Compliance Code
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.61
Access Time-Max
35 ns
JESD-30 Code
R-GDIP-T24
Memory Density
16384 bit
Memory IC Type
UVPROM
Memory Width
8
Number of Functions
1
Number of Terminals
24
Number of Words
2048 words
Number of Words Code
2000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
2KX8
Package Body Material
CERAMIC, GLASS-SEALED
Package Code
DIP
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Screening Level
MIL-STD-883
Supply Current-Max
0.12 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
MILITARY
Terminal Form
THROUGH-HOLE
Terminal Position
DUAL
Want to compare parts?
  1. 5962-8765003JX
    QP Semiconductor
    UVPROM, 2KX8, 35ns, CMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24
    VS

Alternate Parts for 5962-8765003JX

This table gives cross-reference parts and alternative options found for 5962-8765003JX. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-8765003JX, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
CY7C245A-35WMB UVPROM, 2KX8, 25ns, CMOS, CDIP24, 0.300 INCH, SLIM, WINDOWED, CERDIP-24 Cypress Semiconductor 5962-8765003JX vs CY7C245A-35WMB
AM27C45-25DCB UVPROM, 2KX8, 12ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 AMD 5962-8765003JX vs AM27C45-25DCB
5962-8981501LA UVPROM, 2KX8, 25ns, CMOS, CDIP24 Military Specifications 5962-8765003JX vs 5962-8981501LA
PY291A-35WM UVPROM, 2KX8, 35ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 Pyramid Semiconductor Corporation 5962-8765003JX vs PY291A-35WM
AM27C291-35DC UVPROM, 2KX8, 35ns, CMOS, CDIP24, 0.300 INCH, SLIM, CERAMIC, DIP-24 AMD 5962-8765003JX vs AM27C291-35DC
CY7C291-35WMB UVPROM, 2KX8, 35ns, CMOS, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 Cypress Semiconductor 5962-8765003JX vs CY7C291-35WMB
QP7C291AL-35WC UVPROM, 2KX8, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP3-24 QP Semiconductor 5962-8765003JX vs QP7C291AL-35WC
CY7C291-35WC UVPROM, 2KX8, 35ns, CMOS, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 Cypress Semiconductor 5962-8765003JX vs CY7C291-35WC
AM27C45-25/BLA UVPROM, 2KX8, 12ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 AMD 5962-8765003JX vs AM27C45-25/BLA
5962-8752902LA 2KX8 UVPROM, CDIP24, 0.300 INCH, WINDOWED, CERDIP-24 STMicroelectronics 5962-8765003JX vs 5962-8752902LA
Part Number Description Manufacturer Compare
AM27C291-35DC UVPROM, 2KX8, 35ns, CMOS, CDIP24, 0.300 INCH, SLIM, CERAMIC, DIP-24 AMD 5962-8765003JX vs AM27C291-35DC
CY7C291-35WC UVPROM, 2KX8, 35ns, CMOS, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 Cypress Semiconductor 5962-8765003JX vs CY7C291-35WC
AM27C45-25/BLA UVPROM, 2KX8, 12ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 AMD 5962-8765003JX vs AM27C45-25/BLA
5962-8873503LA OTP ROM, 2KX8, CMOS, CDIP24, 0.300 INCH, THIN, CERDIP-24 Waferscale Integration Inc 5962-8765003JX vs 5962-8873503LA
5962-8873502LX OTP ROM, 2KX8, CMOS, CDIP24, Waferscale Integration Inc 5962-8765003JX vs 5962-8873502LX
5962-8981502LA UVPROM, 2KX8, 12ns, CMOS, CDIP24, CERAMIC, DIP-24 Cypress Semiconductor 5962-8765003JX vs 5962-8981502LA
WS57C919C-35D UVPROM, 2KX8, 35ns, CMOS, CDIP24, 0.600 INCH, CERAMIC, DIP-24 Teledyne e2v 5962-8765003JX vs WS57C919C-35D
5962-8765003JX UVPROM, 2KX8, 35ns, CMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 Teledyne e2v 5962-8765003JX vs 5962-8765003JX
CY7C291-35WMB UVPROM, 2KX8, 35ns, CMOS, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 Cypress Semiconductor 5962-8765003JX vs CY7C291-35WMB
5962-8873503LX OTP ROM, 2KX8, 25ns, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, CERDIP-24 Cypress Semiconductor 5962-8765003JX vs 5962-8873503LX

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