Memory
5962-8752902LA
Description: UVPROM, 2KX8, 35ns, CMOS, CDIP24, CERAMIC, DIP-24

Overview of 5962-8752902LA by Teledyne e2v

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Internet of Things (IoT) Robotics and Drones

Available Datasheets

Part # Manufacturer Description Datasheet
5962-8672601EA Rochester Electronics LLC Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.875 INCH, DIP-16
5962-8672601FA Rochester Electronics LLC Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.375 INCH, FP-16
5962-87518013A Rochester Electronics LLC Interrupt Controller, NMOS, CQCC28, CERAMIC, LCC-28

Price & Stock for 5962-8752902LA by Teledyne e2v

Part # Manufacturer Description Stock Price Buy
DISTI # QP7C245A-35WMB
Avnet Americas PROM, UV ERASABLE, 2K X 8, REGISTERED, 3 - Rail/Tube (Alt: QP7C245A-35WMB) Min Qty: 250 Package Multiple: 1 Container: Tube 0
RFQ
DISTI # WS57C45-35TMB
Avnet Americas PROM, UV ERASABLE, 2K X 8, REGISTERED, 3 - Rail/Tube (Alt: WS57C45-35TMB) Min Qty: 250 Package Multiple: 1 Container: Tube 0
RFQ
Teledyne e2v PROM, UV ERASABLE, 2K X 8, REGISTERED, 35 NS SETUP TIME Lead time: 14 Weeks, 0 Days 0
RFQ

CAD Models for 5962-8752902LA by Teledyne e2v
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Part Data Attributes for 5962-8752902LA by Teledyne e2v

5962-8752902LA
Teledyne e2v
-
-
Rohs Code
No
Part Life Cycle Code
Active
Ihs Manufacturer
TELEDYNE E2V (UK) LTD
Part Package Code
DIP
Package Description
CERAMIC, DIP-24
Pin Count
24
Reach Compliance Code
not_compliant
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.61
Access Time-Max
35 ns
I/O Type
COMMON
JESD-30 Code
R-GDIP-T24
JESD-609 Code
e0
Memory Density
16384 bit
Memory IC Type
UVPROM
Memory Width
8
Number of Functions
1
Number of Terminals
24
Number of Words
2048 words
Number of Words Code
2000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
2KX8
Output Characteristics
REGISTERED
Package Body Material
CERAMIC, GLASS-SEALED
Package Code
DIP
Package Equivalence Code
DIP24,.3
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Programming Voltage
13.5 V
Qualification Status
Qualified
Screening Level
MIL-STD-883
Standby Current-Max
0.12 A
Supply Current-Max
0.12 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Want to compare parts?
  1. 5962-8752902LA
    Teledyne e2v
    UVPROM, 2KX8, 35ns, CMOS, CDIP24, CERAMIC, DIP-24
    VS

Alternate Parts for 5962-8752902LA

This table gives cross-reference parts and alternative options found for 5962-8752902LA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-8752902LA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
QP7C292A-35WC UVPROM, 2KX8, CMOS, CDIP24, 0.600 INCH, CERAMIC, GDIP1-24 QP Semiconductor 5962-8752902LA vs QP7C292A-35WC
TMS27C291-3JL 2KX8 UVPROM, 35ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 Texas Instruments 5962-8752902LA vs TMS27C291-3JL
5962-8765003LA UVPROM, 2KX8, 35ns, CMOS, CDIP24, CERAMIC, DIP-24 Cypress Semiconductor 5962-8752902LA vs 5962-8765003LA
CY7C245A-18WI UVPROM, 2KX8, 12ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, SLIM, CERDIP-24 Cypress Semiconductor 5962-8752902LA vs CY7C245A-18WI
CY7C245A-18WC UVPROM, 2KX8, 12ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, CERDIP-24 Cypress Semiconductor 5962-8752902LA vs CY7C245A-18WC
QP7C292A-35WMB UVPROM, 2KX8, CMOS, CDIP24, 0.600 INCH, CERAMIC, GDIP1-24 Teledyne e2v 5962-8752902LA vs QP7C292A-35WMB
5962-8981503LB UVPROM, 2KX8, 12ns, CMOS, CDIP24, CERAMIC, DIP-24 Cypress Semiconductor 5962-8752902LA vs 5962-8981503LB
WS57C291C-35T UVPROM, 2KX8, 35ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 Teledyne e2v 5962-8752902LA vs WS57C291C-35T
QP7C291AL-35WC UVPROM, 2KX8, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP3-24 QP Semiconductor 5962-8752902LA vs QP7C291AL-35WC
5962-8981501LA UVPROM, 2KX8, 15ns, CMOS, CDIP24, CERAMIC, DIP-24 Cypress Semiconductor 5962-8752902LA vs 5962-8981501LA
Part Number Description Manufacturer Compare
QP7C292A-35WC UVPROM, 2KX8, CMOS, CDIP24, 0.600 INCH, CERAMIC, GDIP1-24 QP Semiconductor 5962-8752902LA vs QP7C292A-35WC
5962-8873504LX OTP ROM, 2KX8, 15ns, CMOS, CDIP24 Cypress Semiconductor 5962-8752902LA vs 5962-8873504LX
5962-8752902LX UVPROM, 2KX8, 35ns, CMOS, CDIP24, CERAMIC, DIP-24 Teledyne e2v 5962-8752902LA vs 5962-8752902LX
5962-8873503LX OTP ROM, 2KX8, 15ns, CMOS, CDIP24, CERAMIC, DIP-24 Waferscale Integration Inc 5962-8752902LA vs 5962-8873503LX
QP7C292A-35WMB UVPROM, 2KX8, CMOS, CDIP24, 0.600 INCH, CERAMIC, GDIP1-24 Teledyne e2v 5962-8752902LA vs QP7C292A-35WMB
CY7C245-45PC OTP ROM, 2KX8, 70ns, CMOS, PDIP24, 0.300 INCH, SLIM, PLASTIC, DIP-24 Cypress Semiconductor 5962-8752902LA vs CY7C245-45PC
5962-8981503LB UVPROM, 2KX8, 12ns, CMOS, CDIP24, CERAMIC, DIP-24 Cypress Semiconductor 5962-8752902LA vs 5962-8981503LB
QP7C291A-35WC UVPROM, 2KX8, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP3-24 QP Semiconductor 5962-8752902LA vs QP7C291A-35WC
5962-8873503LX OTP ROM, 2KX8, 25ns, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, CERDIP-24 Cypress Semiconductor 5962-8752902LA vs 5962-8873503LX
5962-8873504LB OTP ROM, 2KX8, 12ns, CMOS, CDIP24, CERAMIC, DIP-24 Cypress Semiconductor 5962-8752902LA vs 5962-8873504LB

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