5962-8752902LA
vs
5962-8873504LB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
TELEDYNE E2V (UK) LTD
CYPRESS SEMICONDUCTOR CORP
Part Package Code
DIP
DIP
Package Description
CERAMIC, DIP-24
DIP,
Pin Count
24
24
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.61
8542.32.00.71
Access Time-Max
35 ns
250 ns
I/O Type
COMMON
JESD-30 Code
R-GDIP-T24
R-GDIP-T24
JESD-609 Code
e0
e0
Memory Density
16384 bit
1048576 bit
Memory IC Type
UVPROM
OTP ROM
Memory Width
8
16
Number of Functions
1
1
Number of Terminals
24
24
Number of Words
2048 words
2048 words
Number of Words Code
2000
64000
Operating Mode
SYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
2KX8
64KX16
Output Characteristics
REGISTERED
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP24,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
13.5 V
Qualification Status
Qualified
Not Qualified
Screening Level
MIL-STD-883
MIL-STD-883
Standby Current-Max
0.12 A
Supply Current-Max
0.12 mA
0.12 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Length
31.877 mm
Seated Height-Max
5.08 mm
Width
7.62 mm
Compare 5962-8752902LA with alternatives
Compare 5962-8873504LB with alternatives