5962-8606314QXX by:

UVPROM, 32KX8, 170ns, CMOS, CDIP28, CERAMIC, DIP-28

Part Details for 5962-8606314QXX by Teledyne e2v

Overview of 5962-8606314QXX by Teledyne e2v

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Applications Education and Research Internet of Things (IoT) Computing and Data Storage Aerospace and Defense Healthcare Telecommunications Automotive

Available Datasheets

Part # Manufacturer Description Datasheet
5962-8672601EA Rochester Electronics LLC Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.875 INCH, DIP-16
5962-8672601FA Rochester Electronics LLC Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.375 INCH, FP-16
5962-87518013A Rochester Electronics LLC Interrupt Controller, NMOS, CQCC28, CERAMIC, LCC-28

Part Details for 5962-8606314QXX

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5962-8606314QXX Part Data Attributes

5962-8606314QXX Teledyne e2v
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5962-8606314QXX Teledyne e2v UVPROM, 32KX8, 170ns, CMOS, CDIP28, CERAMIC, DIP-28
Part Life Cycle Code Active
Ihs Manufacturer TELEDYNE E2V (UK) LTD
Part Package Code DIP
Package Description CERAMIC, DIP-28
Pin Count 28
Reach Compliance Code compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.61
Access Time-Max 170 ns
JESD-30 Code R-GDIP-T28
JESD-609 Code e0
Memory Density 262144 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 32768 words
Number of Words Code 32000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 32KX8
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Screening Level MIL-PRF-38535 Class Q
Supply Current-Max 0.025 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Position DUAL

Alternate Parts for 5962-8606314QXX

This table gives cross-reference parts and alternative options found for 5962-8606314QXX. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-8606314QXX, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
8411104YX UVPROM, 32KX8, 170ns, CMOS, CDIP28, CERAMIC, DIP-28 Rochester Electronics LLC 5962-8606314QXX vs 8411104YX
5962-8606304XX UVPROM, 32KX8, 170ns, CMOS, CDIP28, CERAMIC, DIP-28 AMD 5962-8606314QXX vs 5962-8606304XX
5962-8606314XX UVPROM, 32KX8, 170ns, CMOS, CDIP28, CERAMIC, DIP-28 QP Semiconductor 5962-8606314QXX vs 5962-8606314XX
5962-8606314XX UVPROM, 32KX8, 170ns, CMOS, CDIP28, CERAMIC, DIP-28 Teledyne e2v 5962-8606314QXX vs 5962-8606314XX
5962-8606304XA UVPROM, 32KX8, 170ns, CMOS, CDIP28, CERAMIC, DIP-28 QP Semiconductor 5962-8606314QXX vs 5962-8606304XA
5662-860634XA UVPROM, 32KX8, 170ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 Teledyne e2v 5962-8606314QXX vs 5662-860634XA
5962-8606304UX UVPROM, 32KX8, 170ns, CMOS, CDIP28, CERAMIC, DIP-28 Teledyne e2v 5962-8606314QXX vs 5962-8606304UX
5962-8606304XA UVPROM, 32KX8, 170ns, CMOS, CDIP28, CERAMIC, DIP-28 Teledyne e2v 5962-8606314QXX vs 5962-8606304XA
5962-8606314QXA UVPROM, 32KX8, 170ns, CMOS, CDIP28, CERAMIC, DIP-28 Cypress Semiconductor 5962-8606314QXX vs 5962-8606314QXA
5962-8606304UA UVPROM, 32KX8, 170ns, CMOS, CDIP28, CERAMIC, DIP-28 QP Semiconductor 5962-8606314QXX vs 5962-8606304UA
Part Number Description Manufacturer Compare
5962-8606314QXA UVPROM, 32KX8, 170ns, CMOS, CDIP28, CERAMIC, DIP-28 Cypress Semiconductor 5962-8606314QXX vs 5962-8606314QXA
NM27LC256Q170 IC 32K X 8 UVPROM, 170 ns, CDIP28, CERAMIC, DIP-28, Programmable ROM National Semiconductor Corporation 5962-8606314QXX vs NM27LC256Q170
5962-8606304XA UVPROM, 32KX8, 170ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Atmel Corporation 5962-8606314QXX vs 5962-8606304XA
5962-8606314QXX UVPROM, 32KX8, 170ns, CMOS, CDIP28, CERAMIC, DIP-28 Cypress Semiconductor 5962-8606314QXX vs 5962-8606314QXX
5662-8606314XA UVPROM, 32KX8, 170ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 Teledyne e2v 5962-8606314QXX vs 5662-8606314XA
8411104YX UVPROM, 32KX8, 170ns, CMOS, CDIP28, CERAMIC, DIP-28 Rochester Electronics LLC 5962-8606314QXX vs 8411104YX
5662-8606314YA UVPROM, 32KX8, 170ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 Teledyne e2v 5962-8606314QXX vs 5662-8606314YA
5962-8606304XA UVPROM, 32KX8, 170ns, CMOS, CDIP28, CERAMIC, DIP-28 Intel Corporation 5962-8606314QXX vs 5962-8606304XA
AS27C256A-17JI UVPROM, 32KX8, 170ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Micross Components 5962-8606314QXX vs AS27C256A-17JI
QP27C256-170/QYA UVPROM, 32KX8, 170ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 Teledyne e2v 5962-8606314QXX vs QP27C256-170/QYA

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