Datasheets
5962-8606301XA by:

UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28

Part Details for 5962-8606301XA by Micross Components

Overview of 5962-8606301XA by Micross Components

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Applications Education and Research Internet of Things (IoT) Computing and Data Storage Aerospace and Defense Healthcare Telecommunications Automotive

Part Details for 5962-8606301XA

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5962-8606301XA Part Data Attributes:

5962-8606301XA Micross Components
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5962-8606301XA Micross Components UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28
Part Life Cycle Code Obsolete
Ihs Manufacturer MICROSS COMPONENTS
Part Package Code DIP
Package Description DIP, DIP28,.6
Pin Count 28
Reach Compliance Code compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.61
Access Time-Max 200 ns
I/O Type COMMON
JESD-30 Code R-CDIP-T28
JESD-609 Code e0
Memory Density 262144 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 32768 words
Number of Words Code 32000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 32KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Programming Voltage 12.5 V
Qualification Status Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 5.8928 mm
Standby Current-Max 0.0003 A
Supply Current-Max 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for 5962-8606301XA

This table gives cross-reference parts and alternative options found for 5962-8606301XA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-8606301XA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
5962-8606301XX UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 Atmel Corporation 5962-8606301XA vs 5962-8606301XX
5962-8606301XA UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 Intel Corporation 5962-8606301XA vs 5962-8606301XA
Part Number Description Manufacturer Compare
TMM27256BDI-20 IC 32K X 8 UVPROM, 200 ns, CDIP28, CERDIP-28, Programmable ROM Toshiba America Electronic Components 5962-8606301XA vs TMM27256BDI-20
5962-8606301XA UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 Intel Corporation 5962-8606301XA vs 5962-8606301XA
AM27256-20DIB UVPROM, 32KX8, 200ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 AMD 5962-8606301XA vs AM27256-20DIB
AM27256-20DE UVPROM, 32KX8, 200ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 AMD 5962-8606301XA vs AM27256-20DE
AM27256-20DI UVPROM, 32KX8, 200ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 AMD 5962-8606301XA vs AM27256-20DI
AM27256-20DEB UVPROM, 32KX8, 200ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 AMD 5962-8606301XA vs AM27256-20DEB
27C256-20E/J 32K X 8 UVPROM, 200 ns, CDIP28, 0.600 INCH, CERDIP-28 Microchip Technology Inc 5962-8606301XA vs 27C256-20E/J
AM27C256-205PC OTP ROM, 32KX8, 200ns, CMOS, PDIP28, PLASTIC, DIP-28 AMD 5962-8606301XA vs AM27C256-205PC
AM27256-2DCB UVPROM, 32KX8, 200ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 AMD 5962-8606301XA vs AM27256-2DCB
27C256-20I/J 32K X 8 UVPROM, 200 ns, CDIP28, 0.600 INCH, CERDIP-28 Microchip Technology Inc 5962-8606301XA vs 27C256-20I/J

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