5962-8606301XA vs 5962-8606301XA feature comparison

5962-8606301XA Micross Components

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5962-8606301XA Intel Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSS COMPONENTS INTEL CORP
Part Package Code DIP DIP
Package Description DIP, DIP28,.6 DIP, DIP28,.6
Pin Count 28 28
Reach Compliance Code compliant unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 200 ns 200 ns
I/O Type COMMON COMMON
JESD-30 Code R-CDIP-T28 R-GDIP-T28
JESD-609 Code e0 e0
Memory Density 262144 bit 262144 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 32KX8 32KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP28,.6 DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 12.5 V 12.5 V
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 MIL-STD-883
Seated Height-Max 5.8928 mm
Standby Current-Max 0.0003 A 0.0003 A
Supply Current-Max 0.05 mA 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm
Base Number Matches 1 1
Rohs Code No

Compare 5962-8606301XA with alternatives

Compare 5962-8606301XA with alternatives