5962-8606301XA by:

UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28

Part Details for 5962-8606301XA by LSI Corporation

Overview of 5962-8606301XA by LSI Corporation

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Applications Education and Research Internet of Things (IoT) Computing and Data Storage Aerospace and Defense Healthcare Telecommunications Automotive

Part Details for 5962-8606301XA

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5962-8606301XA Part Data Attributes:

5962-8606301XA LSI Corporation
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5962-8606301XA LSI Corporation UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28
Part Life Cycle Code Obsolete
Ihs Manufacturer SEEQ TECHNOLOGY INC
Part Package Code DIP
Package Description WDIP,
Pin Count 28
Reach Compliance Code unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.61
Access Time-Max 200 ns
JESD-30 Code R-GDIP-T28
JESD-609 Code e0
Length 37.1475 mm
Memory Density 262144 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 32768 words
Number of Words Code 32000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 32KX8
Package Body Material CERAMIC, GLASS-SEALED
Package Code WDIP
Package Shape RECTANGULAR
Package Style IN-LINE, WINDOW
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.588 mm
Supply Current-Max 0.025 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for 5962-8606301XA

This table gives cross-reference parts and alternative options found for 5962-8606301XA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-8606301XA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
AT27C256R-20DI UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Atmel Corporation 5962-8606301XA vs AT27C256R-20DI
5962-8606301XX 32KX8 UVPROM, 200ns, CDIP28, WINDOWED, CERAMIC, DIP-28 Texas Instruments 5962-8606301XA vs 5962-8606301XX
AT27C256R-20DM/883 UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Atmel Corporation 5962-8606301XA vs AT27C256R-20DM/883
5962-8606301XX UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Waferscale Integration Inc 5962-8606301XA vs 5962-8606301XX
5962-8606301XA UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Waferscale Integration Inc 5962-8606301XA vs 5962-8606301XA
5962-8606301XX UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Micross Components 5962-8606301XA vs 5962-8606301XX
5962-8606301XX UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD 5962-8606301XA vs 5962-8606301XX
5962-8606301XX UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 Atmel Corporation 5962-8606301XA vs 5962-8606301XX
FT27C256R-20DMB UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28 Force Technologies Ltd 5962-8606301XA vs FT27C256R-20DMB
5962-8606301XX UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 VLSI Technology Inc 5962-8606301XA vs 5962-8606301XX
Part Number Description Manufacturer Compare
AM27C256-200DCB UVPROM, 32KX8, 200ns, CMOS, CDIP28, DIP-28 Spansion 5962-8606301XA vs AM27C256-200DCB
MBM27C256A-20WZ UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERDIP-28 FUJITSU Semiconductor Limited 5962-8606301XA vs MBM27C256A-20WZ
TMX27PC256-2NL 32KX8 OTPROM, 200ns, PDIP28 Texas Instruments 5962-8606301XA vs TMX27PC256-2NL
TMS27PC256-2NL 262 144-Bitprogrammable Read-Only Memory 28-PDIP 0 to 70 Texas Instruments 5962-8606301XA vs TMS27PC256-2NL
NMC27C256Q200 IC 32K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM National Semiconductor Corporation 5962-8606301XA vs NMC27C256Q200
NM27C256QM150 IC 32K X 8 UVPROM, 150 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM National Semiconductor Corporation 5962-8606301XA vs NM27C256QM150
CY27C256A-200QMB UVPROM, 32KX8, 200ns, CMOS, CQCC32, HERMETIC SEALED, WINDOWED, LCC-32 Rochester Electronics LLC 5962-8606301XA vs CY27C256A-200QMB
M27C256B-20F1L 32KX8 UVPROM, 200ns, CDIP28, WINDOWED, FRIT SEALED, CERAMIC, DIP-28 STMicroelectronics 5962-8606301XA vs M27C256B-20F1L
CY27C256A-200WMB UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, HERMETIC SEALED, WINDOWED, CERDIP-28 Cypress Semiconductor 5962-8606301XA vs CY27C256A-200WMB
AT27LV256R-20DC UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Atmel Corporation 5962-8606301XA vs AT27LV256R-20DC

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