Part Details for 5962-0320302QKA by Teledyne e2v
Overview of 5962-0320302QKA by Teledyne e2v
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (6 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Education and Research
Internet of Things (IoT)
Industrial Automation
Computing and Data Storage
Aerospace and Defense
Healthcare
Telecommunications
Electronic Manufacturing
Automotive
Part Details for 5962-0320302QKA
5962-0320302QKA CAD Models
5962-0320302QKA Part Data Attributes
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5962-0320302QKA
Teledyne e2v
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5962-0320302QKA
Teledyne e2v
OTP ROM, 2KX8, 50ns, Bipolar, CDFP24, CERAMIC, DFP-24
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | E2V TECHNOLOGIES PLC | |
Part Package Code | DFP | |
Package Description | DFP, FL24,.4 | |
Pin Count | 24 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Access Time-Max | 50 ns | |
JESD-30 Code | R-GDFP-F24 | |
JESD-609 Code | e0 | |
Memory Density | 16384 bit | |
Memory IC Type | OTP ROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 24 | |
Number of Words | 2048 words | |
Number of Words Code | 2000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Organization | 2KX8 | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | DFP | |
Package Equivalence Code | FL24,.4 | |
Package Shape | RECTANGULAR | |
Package Style | FLATPACK | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Screening Level | MIL-PRF-38535 Class Q | |
Supply Current-Max | 0.185 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | BIPOLAR | |
Temperature Grade | MILITARY | |
Terminal Finish | TIN LEAD | |
Terminal Form | FLAT | |
Terminal Pitch | 1.27 mm | |
Terminal Position | DUAL |
Alternate Parts for 5962-0320302QKA
This table gives cross-reference parts and alternative options found for 5962-0320302QKA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-0320302QKA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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63S1681WXXXX | OTP ROM, 2KX8, 50ns, CMOS, CDFP24, | Monolithic Memories (RETIRED) | 5962-0320302QKA vs 63S1681WXXXX |
AM27S190A/BKA | OTP ROM, 2KX8, 50ns, Bipolar, CDFP24, CERAMIC, FP-24 | AMD | 5962-0320302QKA vs AM27S190A/BKA |
5962-0320302QKA | OTP ROM, 2KX8, 50ns, Bipolar, CDFP24, CERAMIC, DFP-24 | QP Semiconductor | 5962-0320302QKA vs 5962-0320302QKA |
5962-0320302QKX | OTP ROM, 2KX8, 50ns, Bipolar, CDFP24, CERAMIC, DFP-24 | Teledyne e2v | 5962-0320302QKA vs 5962-0320302QKX |
AM27S191A/BKA | OTP ROM, 2KX8, 50ns, Bipolar, CDFP24, CERAMIC, FP-24 | AMD | 5962-0320302QKA vs AM27S191A/BKA |
5962-0320302QKX | OTP ROM, 2KX8, 50ns, Bipolar, CDFP24, CERAMIC, DFP-24 | QP Semiconductor | 5962-0320302QKA vs 5962-0320302QKX |