Datasheets
27LV64-25I/K by: Microchip Technology Inc

8K X 8 UVPROM, 250 ns, CQCC32, CERAMIC, LCC-32

Part Details for 27LV64-25I/K by Microchip Technology Inc

Overview of 27LV64-25I/K by Microchip Technology Inc

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Applications Consumer Electronics Industrial Automation Computing and Data Storage Renewable Energy Robotics and Drones

Part Details for 27LV64-25I/K

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27LV64-25I/K Part Data Attributes

27LV64-25I/K Microchip Technology Inc
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27LV64-25I/K Microchip Technology Inc 8K X 8 UVPROM, 250 ns, CQCC32, CERAMIC, LCC-32
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC
Part Package Code QFJ
Package Description CERAMIC, LCC-32
Pin Count 32
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.61
Access Time-Max 250 ns
I/O Type COMMON
JESD-30 Code R-CQCC-N32
JESD-609 Code e0
Length 13.97 mm
Memory Density 65536 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 8192 words
Number of Words Code 8000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 8KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code QCCN
Package Equivalence Code LCC32,.45X.55
Package Shape RECTANGULAR
Package Style CHIP CARRIER
Parallel/Serial PARALLEL
Programming Voltage 13 V
Qualification Status Not Qualified
Seated Height-Max 3.048 mm
Standby Current-Max 0.0001 A
Supply Current-Max 0.025 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form NO LEAD
Terminal Pitch 1.27 mm
Terminal Position QUAD
Width 11.43 mm

Alternate Parts for 27LV64-25I/K

This table gives cross-reference parts and alternative options found for 27LV64-25I/K. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 27LV64-25I/K, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
AM2764A-25LC UVPROM, 8KX8, 250ns, NMOS, CQCC32, CERAMIC, LCC-32 AMD 27LV64-25I/K vs AM2764A-25LC
27C64MEQ25 UVPROM, 8KX8, 250ns, CMOS, CQCC32, CERAMIC, LCC-32 Thales Group 27LV64-25I/K vs 27C64MEQ25
AM27C64-255LEB UVPROM, 8KX8, 250ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 AMD 27LV64-25I/K vs AM27C64-255LEB
MBM27C64-25-X UVPROM, 8KX8, 250ns, CMOS, CQCC32, METAL SEALED, CERAMIC, LCC-32 FUJITSU Semiconductor Limited 27LV64-25I/K vs MBM27C64-25-X
AM27C64-255LIB UVPROM, 8KX8, 250ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 AMD 27LV64-25I/K vs AM27C64-255LIB
AM27C64-255LE UVPROM, 8KX8, 250ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 AMD 27LV64-25I/K vs AM27C64-255LE
27C64MEQ1B/C25 UVPROM, 8KX8, 250ns, CMOS, CQCC32, CERAMIC, LCC-32 Thales Group 27LV64-25I/K vs 27C64MEQ1B/C25
AM27C64-250LI UVPROM, 8KX8, 250ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 AMD 27LV64-25I/K vs AM27C64-250LI
MBM27C64-25 UVPROM, 8KX8, 250ns, CMOS, CQCC32, METAL SEALED, CERAMIC, LCC-32 FUJITSU Semiconductor Limited 27LV64-25I/K vs MBM27C64-25
27C64MEQ1B/C25 UVPROM, 8KX8, 250ns, CMOS, CQCC32, CERAMIC, LCC-32 Teledyne e2v 27LV64-25I/K vs 27C64MEQ1B/C25
Part Number Description Manufacturer Compare
AM27C64-255LCB UVPROM, 8KX8, 250ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 AMD 27LV64-25I/K vs AM27C64-255LCB
AM27C64-250LI UVPROM, 8KX8, 250ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 AMD 27LV64-25I/K vs AM27C64-250LI
AM2764A-25LCB UVPROM, 8KX8, 250ns, NMOS, CQCC32, CERAMIC, LCC-32 AMD 27LV64-25I/K vs AM2764A-25LCB
27LV64-25/K 8K X 8 UVPROM, 250 ns, CQCC32, CERAMIC, LCC-32 Microchip Technology Inc 27LV64-25I/K vs 27LV64-25/K
27C64-25E/K 8K X 8 UVPROM, 250 ns, CQCC32, CERAMIC, LCC-32 Microchip Technology Inc 27LV64-25I/K vs 27C64-25E/K
MBM27C64-25-X UVPROM, 8KX8, 250ns, CMOS, CQCC32, METAL SEALED, CERAMIC, LCC-32 FUJITSU Semiconductor Limited 27LV64-25I/K vs MBM27C64-25-X
AM27C64-250/BUA UVPROM, 8KX8, 250ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 AMD 27LV64-25I/K vs AM27C64-250/BUA
27C64MEQ7B/Y25 UVPROM, 8KX8, 250ns, CMOS, CQCC32, CERAMIC, LCC-32 Teledyne e2v 27LV64-25I/K vs 27C64MEQ7B/Y25
AM27C64-250LEB UVPROM, 8KX8, 250ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 AMD 27LV64-25I/K vs AM27C64-250LEB
MBM2764-25 8KX8 UVPROM, 250ns, CQCC32, METAL SEALED, CERAMIC, LCC-32 FUJITSU Limited 27LV64-25I/K vs MBM2764-25

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