27LV64-25I/K vs MBM27C64-25 feature comparison

27LV64-25I/K Microchip Technology Inc

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MBM27C64-25 FUJITSU Semiconductor Limited

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC FUJITSU SEMICONDUCTOR AMERICA INC
Part Package Code QFJ
Package Description CERAMIC, LCC-32 WQCCN,
Pin Count 32
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 250 ns 250 ns
I/O Type COMMON
JESD-30 Code R-CQCC-N32 R-CQCC-N32
JESD-609 Code e0
Length 13.97 mm 13.97 mm
Memory Density 65536 bit 65536 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 8KX8 8KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code QCCN WQCCN
Package Equivalence Code LCC32,.45X.55
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER CHIP CARRIER, WINDOW
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 13 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.048 mm 3.3 mm
Standby Current-Max 0.0001 A
Supply Current-Max 0.025 mA 0.03 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form NO LEAD NO LEAD
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Width 11.43 mm 11.43 mm
Base Number Matches 1 7

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