Part Details for 27C256MQ25 by Thales Group
Overview of 27C256MQ25 by Thales Group
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part Details for 27C256MQ25
27C256MQ25 CAD Models
27C256MQ25 Part Data Attributes
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27C256MQ25
Thales Group
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Datasheet
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27C256MQ25
Thales Group
UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | THOMSON-CSF SEMICONDUCTORS | |
| Part Package Code | DIP | |
| Package Description | , | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 250 ns | |
| JESD-30 Code | R-GDIP-T28 | |
| Memory Density | 262144 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 32KX8 | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Position | DUAL |
Alternate Parts for 27C256MQ25
This table gives cross-reference parts and alternative options found for 27C256MQ25. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 27C256MQ25, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 27C256MQ7B/Y25 | UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Thales Group | 27C256MQ25 vs 27C256MQ7B/Y25 |
| 5962-8606312XX | UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Micross Components | 27C256MQ25 vs 5962-8606312XX |
| AS27C256A-25JM | Memory IC | Micross Components | 27C256MQ25 vs AS27C256A-25JM |
| 5962-8606312XA | UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Teledyne e2v | 27C256MQ25 vs 5962-8606312XA |
| AS27C256A-25JI | UVPROM, 32KX8, 250ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 | Micross Components | 27C256MQ25 vs AS27C256A-25JI |
| 5962-8606302XX | UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Waferscale Integration Inc | 27C256MQ25 vs 5962-8606302XX |
| M38510/22401BYA | UVPROM, 32KX8, 250ns, MOS, 0.5 X 0.625 INCH, DIP-28 | AMD | 27C256MQ25 vs M38510/22401BYA |
| 8411102YX | UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | AMD | 27C256MQ25 vs 8411102YX |
| 5962-8606312XA | UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | QP Semiconductor | 27C256MQ25 vs 5962-8606312XA |
| 5962-8606302XX | UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Rochester Electronics LLC | 27C256MQ25 vs 5962-8606302XX |