ZXFV401N16TC
vs
TDA9181P
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
DIODES INC
|
NXP SEMICONDUCTORS
|
Part Package Code |
SOIC
|
DIP
|
Package Description |
SSOP,
|
0.300 INCH, PLASTIC, SOT38-4, DIP-16
|
Pin Count |
16
|
16
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Consumer IC Type |
SYNC SEPARATOR IC
|
Y/C SEPARATOR IC
|
JESD-30 Code |
R-PDSO-G16
|
R-PDIP-T16
|
Length |
4.9 mm
|
19.05 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
-25 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SSOP
|
DIP
|
Package Equivalence Code |
SSOP16,.25
|
DIP16,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, SHRINK PITCH
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.75 mm
|
4.2 mm
|
Supply Voltage-Max (Vsup) |
5.25 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.75 V
|
4.5 V
|
Surface Mount |
YES
|
NO
|
Temperature Grade |
INDUSTRIAL
|
OTHER
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
0.635 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
3.9116 mm
|
7.62 mm
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
|
|
|
Compare ZXFV401N16TC with alternatives
Compare TDA9181P with alternatives