ZL50051GAC vs ZL50023GAG2 feature comparison

ZL50051GAC Microsemi Corporation

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ZL50023GAG2 Microsemi Corporation

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Part Package Code BGA BGA
Package Description 17 X 17 MM, 1.61 MM HEIGHT, 1 MM PITCH, PLASTIC, MS-034, BGA-256 BGA, BGA256,16X16,40
Pin Count 256 256
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0 e1
Length 17 mm 17 mm
Number of Functions 1 1
Number of Terminals 256 256
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.8 mm 1.8 mm
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Telecom IC Type DIGITAL TIME SWITCH DIGITAL TIME SWITCH
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 17 mm 17 mm
Base Number Matches 2 3
Supply Current-Max 130 mA
Technology CMOS

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