ZL50051GAC
vs
ZL50018QCG1
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
BGA
|
|
| Package Description |
17 X 17 MM, 1.61 MM HEIGHT, 1 MM PITCH, PLASTIC, MS-034, BGA-256
|
28 X 28 MM, 1.40 MM HEIGHT, LEAD FREE, MS-026BJC, LQFP-256
|
| Pin Count |
256
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
|
| JESD-30 Code |
S-PBGA-B256
|
S-PQFP-G256
|
| JESD-609 Code |
e0
|
e3
|
| Length |
17 mm
|
28 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
256
|
256
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
LFQFP
|
| Package Equivalence Code |
BGA256,16X16,40
|
QFP256,1.2SQ,16
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.8 mm
|
1.6 mm
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
DIGITAL TIME SWITCH
|
DIGITAL TIME SWITCH
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
Matte Tin (Sn)
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
1 mm
|
0.4 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Width |
17 mm
|
28 mm
|
| Base Number Matches |
2
|
3
|
| Supply Current-Max |
|
165 mA
|
|
|
|
Compare ZL50051GAC with alternatives
Compare ZL50018QCG1 with alternatives