ZL50018GAG2
vs
VSC851-FX
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI CORP
VITESSE SEMICONDUCTOR CORP
Part Package Code
BGA
QFP
Package Description
17 X 17 MM, 1.61 MM HEIGHT, LEAD FREE, PLASTIC, MS-034, BGA-256
HQFF,
Pin Count
256
256
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B256
S-CQFP-F256
JESD-609 Code
e1
Length
17 mm
37.08 mm
Number of Functions
1
1
Number of Terminals
256
256
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
BGA
HQFF
Package Equivalence Code
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
FLATPACK, HEAT SINK/SLUG
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.8 mm
2.92 mm
Supply Current-Max
165 mA
Supply Voltage-Nom
1.8 V
3.3 V
Surface Mount
YES
YES
Telecom IC Type
DIGITAL TIME SWITCH
DIGITAL TIME SWITCH
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
FLAT
Terminal Pitch
1 mm
0.5 mm
Terminal Position
BOTTOM
QUAD
Width
17 mm
37.08 mm
Base Number Matches
1
1
Compare ZL50018GAG2 with alternatives
Compare VSC851-FX with alternatives