Z8400BD6
vs
G65SC112DI-1
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
GTE MICROCIRCUITS
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP, DIP40,.6
|
DIP, DIP40,.6
|
| Pin Count |
40
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
DRAM REFRESH CONTROLLER
|
|
| Address Bus Width |
16
|
|
| Bit Size |
8
|
8
|
| Boundary Scan |
NO
|
|
| Clock Frequency-Max |
6 MHz
|
|
| External Data Bus Width |
8
|
|
| Format |
FIXED POINT
|
|
| Integrated Cache |
NO
|
|
| JESD-30 Code |
R-CDIP-T40
|
R-XDIP-T40
|
| JESD-609 Code |
e0
|
e0
|
| Low Power Mode |
NO
|
|
| Number of DMA Channels |
|
|
| Number of External Interrupts |
2
|
|
| Number of Serial I/Os |
|
|
| Number of Terminals |
40
|
40
|
| On Chip Data RAM Width |
|
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP40,.6
|
DIP40,.6
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
0
|
|
| Seated Height-Max |
3.6 mm
|
|
| Speed |
6 MHz
|
1 MHz
|
| Supply Current-Max |
200 mA
|
|
| Supply Voltage-Max |
5.25 V
|
|
| Supply Voltage-Min |
4.75 V
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
NMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
15.24 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare Z8400BD6 with alternatives