Z8003BB1 vs MC68008P8 feature comparison

Z8003BB1 STMicroelectronics

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MC68008P8 Motorola Mobility LLC

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS MOTOROLA INC
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 48 48
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 16 20
Bit Size 16 32
Boundary Scan NO NO
Clock Frequency-Max 10 MHz 8 MHz
External Data Bus Width 16 8
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code R-PDIP-T48 R-PDIP-T48
Low Power Mode NO NO
Number of Terminals 48 48
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Speed 10 MHz 8 MHz
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 1 1
Rohs Code No
JESD-609 Code e0
Length 61.72 mm
Number of DMA Channels
Number of External Interrupts 3
Number of Serial I/Os
On Chip Data RAM Width
RAM (words) 0
Seated Height-Max 5.08 mm
Supply Current-Max 25 mA
Terminal Finish TIN LEAD

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