XR21B1411IL16MTR-F
vs
FT232BL-TRAY
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
EXAR CORP
FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD
Package Description
QFN-16
LQFP, LCC32,.2SQ,20
Reach Compliance Code
compliant
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
Bus Compatibility
UART
Data Transfer Rate-Max
1.5 MBps
Drive Interface Standard
RS232; RS485
External Data Bus Width
JESD-30 Code
S-XQCC-N16
S-PQFP-G32
Length
3 mm
7 mm
Number of Terminals
16
32
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
HVQCCN
LQFP
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
FLATPACK, LOW PROFILE
Seated Height-Max
1 mm
1.6 mm
Supply Voltage-Max
5.25 V
5.25 V
Supply Voltage-Min
4.4 V
4.35 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
0.8 mm
Terminal Position
QUAD
QUAD
Width
3 mm
7 mm
uPs/uCs/Peripheral ICs Type
BUS CONTROLLER, UNIVERSAL SERIAL BUS
BUS CONTROLLER, UNIVERSAL SERIAL BUS
Base Number Matches
1
1
Pbfree Code
Yes
Rohs Code
Yes
Part Package Code
QFP
Pin Count
32
ECCN Code
EAR99
Samacsys Manufacturer
FTDI Chip
Clock Frequency-Max
6 MHz
JESD-609 Code
e3
Moisture Sensitivity Level
3
Package Equivalence Code
QFP32,.35SQ,32
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Terminal Finish
MATTE TIN
Time@Peak Reflow Temperature-Max (s)
30
Compare XR21B1411IL16MTR-F with alternatives
Compare FT232BL-TRAY with alternatives