XR21B1411IL16MTR-F vs FT232BL-TRAY feature comparison

XR21B1411IL16MTR-F Exar Corporation

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FT232BL-TRAY FTDI Chip

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer EXAR CORP FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD
Package Description QFN-16 LQFP, LCC32,.2SQ,20
Reach Compliance Code compliant compliant
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width
Bus Compatibility UART
Data Transfer Rate-Max 1.5 MBps
Drive Interface Standard RS232; RS485
External Data Bus Width
JESD-30 Code S-XQCC-N16 S-PQFP-G32
Length 3 mm 7 mm
Number of Terminals 16 32
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code HVQCCN LQFP
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE FLATPACK, LOW PROFILE
Seated Height-Max 1 mm 1.6 mm
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.4 V 4.35 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 0.8 mm
Terminal Position QUAD QUAD
Width 3 mm 7 mm
uPs/uCs/Peripheral ICs Type BUS CONTROLLER, UNIVERSAL SERIAL BUS BUS CONTROLLER, UNIVERSAL SERIAL BUS
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code QFP
Pin Count 32
ECCN Code EAR99
Samacsys Manufacturer FTDI Chip
Clock Frequency-Max 6 MHz
JESD-609 Code e3
Moisture Sensitivity Level 3
Package Equivalence Code QFP32,.35SQ,32
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Terminal Finish MATTE TIN
Time@Peak Reflow Temperature-Max (s) 30

Compare XR21B1411IL16MTR-F with alternatives

Compare FT232BL-TRAY with alternatives